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Printed circuit board distribution structure

A technology of printed circuit board and layout structure, which is applied in the direction of printed circuit, printed circuit manufacturing, electrical components, etc., and can solve the problems of increasing material and assembly costs, affecting the accuracy of ambient temperature, etc.

Inactive Publication Date: 2006-05-10
BENQ CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the electronic signal load, the electronic component 120 itself will generate a heat source, and the heat H is easily conducted to the temperature detection element 110 through the printed circuit board 100, thus affecting the accuracy of the ambient temperature detected by the temperature detection element 110
[0004] However, if in order to solve this problem, the temperature detection element 110 is independently laid out on another separate printed circuit board, but it will increase the cost of materials and assembly.

Method used

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  • Printed circuit board distribution structure
  • Printed circuit board distribution structure
  • Printed circuit board distribution structure

Examples

Experimental program
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Embodiment Construction

[0019] Please refer to Figure 2A , Which shows a schematic diagram of a printed circuit board layout structure according to a preferred embodiment of the present invention. The printed circuit board 200 can be used in electronic and electrical devices such as optical disc players, projectors or rear projection televisions (RPTV), and its layout structure includes a temperature detection element 210, a thermal element 220, and an opening 230. The temperature detection element 210 may be an integrated circuit (IC) or a thermistor, which is connected to the printed circuit board 200 to detect the ambient temperature of the printed circuit board 200. The connection method of the temperature detection element 210 to the printed circuit board 200 may be a surface mounted design (SMD) structure or a plug-in structure. The thermal element 220 is connected to the printed circuit board 200 and is an electronic element or mechanical element (such as a metal heat sink) that will dissipate he...

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PUM

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Abstract

This invention relates to one printing circuit board distribution structure, which comprises heat element, temperature test element and opening, wherein, the test element is to test circle temperature of circuit board; the opening is located between temperature element and heat element on circuit board to lower thermal element heat transmission to test element.

Description

Technical field [0001] The present invention relates to a layout structure of a printed circuit board (Printed Circuit Board, PCB), and particularly relates to a layout structure of a printed circuit board with temperature detection elements. Background technique [0002] Most of the existing electronic and electrical devices, whether it is information home appliances or industrial products, take into account the use of different ambient temperatures such as normal temperature and high temperature, and often change the speed of the heat dissipation motor according to the change of different ambient temperature. In order to achieve the operation of low speed at normal temperature, and high speed at high temperature. The temperature detection components used to detect the ambient temperature are often placed on a printed circuit board for layout with other electronic components. [0003] figure 1 It is a schematic diagram of the structure of a conventional printed circuit board. ...

Claims

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Application Information

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IPC IPC(8): H05K1/00H05K3/00
Inventor 杨舜杰林信男沈俊明
Owner BENQ CORP