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Light high-stiffness XY working platform and bonding head

A workbench and high-rigidity technology, applied in metal processing, electrical components, electrical solid devices, etc., to achieve the effects of stable machine operation, error elimination, and long service life

Inactive Publication Date: 2006-05-17
THE 45TH RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a light-weight and high-rigidity XY workbench and bonding head, which can solve the defects of the existing workbench and bonding head, can improve the precision and speed of the workbench at the same time, and the structure is simple, the work is stable and reliable, and it is convenient maintenance, long service life

Method used

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  • Light high-stiffness XY working platform and bonding head
  • Light high-stiffness XY working platform and bonding head
  • Light high-stiffness XY working platform and bonding head

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Embodiment Construction

[0014] The invention utilizes the linear motor mounted on the base to drive the slider on the guide rail and the integrated movement of the bonding head to complete the processing of the semiconductor device.

[0015] refer to figure 1 , figure 2 , image 3 In the present invention, the worktable is installed on the machine base 6 with fasteners, and the horizontal driving linear motor 2 and the longitudinal driving linear motor 1 are installed on the worktable. The transverse guide rail 7 on the worktable moves, the longitudinal front slide block 4 and the longitudinal front guide rail 8 are fixed on the transverse slide block 3, the longitudinal front slide block 4 is connected with the longitudinal rear slide block 5 through the decoupling mechanism 10, and the longitudinal rear slide block 5 It is installed on the longitudinal rear guide rail 9 fixed on the base 6 and connected with the longitudinal driving linear motor 1. The longitudinal driving linear motor 1 drives ...

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Abstract

A light and high rigidity XY operation table is composed of linear track and sliding block driven by motor to move horizontally and longitudinally, arc swing structure, sliding bock and track being vertical to each other at horizontal and longitudinal direction, decoupling mechanism between longitudinal shafts and their driving motors. Its bonding head applies moving mode of swinging around swing arm to generate arc comprehensive movement for improving its dynamic property.

Description

technical field [0001] The invention relates to a light-weight and high-rigidity two-dimensional worktable and a bonding head structure. The worktable and the bonding head are suitable for metal wire bonding machines, and are especially suitable for production equipment of semiconductor devices. technical background [0002] Metal wire bonding machine is a key equipment for semiconductor production that connects chip pads and package pins with metal wires. The basic feature of the working process of the bonding machine is to form various special arc shapes that meet the needs of different packaging forms by guiding the metal leads to perform complex and high-speed movements in three-dimensional space. The design of the worktable and the bonding head is not only the choice of the mechanical structure, but also closely connected with the motor driving method used to form an organic whole. At present, the common design of worktable and bonding head mostly adopts the method of ...

Claims

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Application Information

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IPC IPC(8): H01L21/60B23K3/00
CPCH01L24/78H01L2224/78H01L2924/00012
Inventor 何田王双江廉军
Owner THE 45TH RES INST OF CETC
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