Adhesive chuck device

A technology for chucks and components, which is applied in the directions of optical/shielding devices, transportation and packaging, tube structure parts, etc., can solve the problems of high manufacturing cost and difficulty in manufacturing large-sized electrostatic chucks, and achieve simple peeling mechanism and reduce The incidence of failure and the effect of reducing manufacturing costs

Active Publication Date: 2006-05-24
SHIN ETSU ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Conventionally, in a substrate laminating machine that overlaps two substrates, the substrate is held by an electrostatic chuck. However, with the increase in the size of the substrate in recent years, it has become difficult to manufacture a large-sized electrostatic chuck, and even if it can be manufactured, the cost is very high. high

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0050] The Example 1, as Figure 1 ~ Figure 2 As shown, the following situation is shown, that is, the upper and lower holding plates 1, 2 are flat plate platforms formed by rigid bodies such as metals, ceramics, etc., so that there is no bending (bending) deformation, and only the upper holding plate 1 of these The substrate side is covered by a plate-shaped body 4' composed of a plurality of bonding members 3 and a plurality of deformable films (pressurized films) 4, which hold the plate 1 from the substrate side by utilizing pressurization. The protrusion (convex shape) is deformed, whereby the upper substrate A is forcibly pulled away from the bonding surface 3 a of the bonding member 3 to perform peeling.

[0051] On the holding surface 1a of the upper holding plate 1, a plurality of or single recesses 1b are recessed, and these recesses 1b are connected with suction sources (not shown) such as vacuum pumps, compressors, etc. The operation of the gas source discharges th...

Embodiment approach 2

[0071] The embodiment 2 as Figure 3 ~ Figure 4 As shown, from the partition wall 1d formed on the holding surface 1a of the aforementioned holding plate 1 throughout the bonding member 3 and the deformable film 4, a plurality of air holes 1e are opened in a penetrating shape, and these air holes 1e are communicated with, for example, a vacuum pump, a compressor, etc. The ventilation passage 1f of the suction source (not shown in the figure) of the machine etc. is formed in a different system from the ventilation passage 1c of the aforementioned recessed portion 1b. This structure is different from the aforementioned Figure 1 ~ Figure 2 The shown embodiment 1 is different, other structures are with Figure 1 ~ Figure 2 Example 1 shown is the same.

[0072] According to the above composition, if image 3 As shown in (a), when the upper substrate A is placed on the holding surface 1a of the upper holding plate 1, the upper substrate A can be sucked and held with a stronger fo...

Embodiment approach 3

[0075] The Example 3, as Figure 5 ~ Figure 6 As shown, the following structure is the same as the aforementioned Figure 1 ~ Figure 2 Shown in Example 1 and Figure 3 ~ Figure 4 The shown embodiment 2 is different, in addition to other structures and Figure 1 ~ Figure 2 Shown in Example 1 and Figure 3 ~ Figure 4 The shown embodiment 2 is the same, and the different structure is: instead of the above-mentioned ring-shaped bonding member 3, a bonding member 3' is set on a part of the aforementioned deformable membrane 4, so as to constitute a plurality of deformable membranes 4 The plate-like body 4 " that constitutes with the bonding member 3 ' covers the substrate side of the upper holding plate 1 by the plate-shaped body 4 ", and at the same time, in the state where the deformable film 4 is made flat, the bonding member 3 ' The adhesive surface 3a' is brought into contact with the upper substrate A to be bonded and held, and on the other hand, the deformable film 4 is d...

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PUM

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Abstract

An adhesive chuck device capable of reliably loading and unloading substrates with a simple structure, on the substrate side of a holding plate (1), an adhesive member (3) and a deformable film (4) are provided, and the adhesive member (3) and The reverse side (A1) of the substrate (A) is relatively bonded and maintained, and the deformable film (4) can be deformed in and out in a direction intersecting with the side of the substrate (1a), and the substrate (A ) is bonded in contact with the bonding surface (3a) of the bonding member (3), and at the same time by forcibly pulling the two apart, the substrate (A) can be easily removed from the bonding surface of the bonding member (3) (3a) Stripping.

Description

technical field [0001] The present invention relates to a bonding chuck device used in a substrate assembly device including a substrate bonding machine used in, for example, a liquid crystal display (LCD) In the manufacturing process of flat panel displays such as plasma displays (PDP), glass substrates such as CF glass and TFT glass or synthetic resin substrates are bonded and held together. [0002] More specifically, it relates to a bonding chuck device for freely holding a substrate by bonding attachment and detachment with respect to a holding plate. Background technique [0003] Conventionally, in a substrate laminating machine that superimposes two substrates, the substrate is held by an electrostatic chuck. However, as the size of the substrate has increased in recent years, it has become difficult to manufacture a large-sized electrostatic chuck, and even if it can be manufactured, the cost is very high. high. [0004] Therefore, in order to solve these problems,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/13B65G49/06G02F1/1333H01J11/20H01J11/44H01L21/683
CPCB65G49/061B65G2249/045G02F1/133354G02F1/13
Inventor 大谷义和横田道也
Owner SHIN ETSU ENG
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