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Over-current protection apparatus and its manufacturing method

A technology for protection devices and manufacturing methods, applied in the direction of resistance manufacturing, circuits, resistors, etc., can solve the problems of inapplicability, surface wrinkles of the insulating layer 104, and limited application range, and achieve the effect of avoiding the influence of high heat

Inactive Publication Date: 2006-07-19
POLYTRONICS TECH
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  • Summary
  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

However, because the PTC component 11 and the insulating layer 104 in the existing overcurrent protection device need to undergo high-temperature compression bonding, which is equivalent to a high-heat treatment step, it is easy to form wrinkles on the surface of the insulating layer 104
The current practice to avoid wrinkles is to use a thicker PTC component 11 and insulating layer 104, but this will make the overcurrent protection device 10 thicker than 100 microns (μm), which is not suitable for miniaturization electronic device
In addition, the resistance value of the overcurrent protection device 10 after high-temperature compression bonding is often more than 1.5 times the resistance value of the PTC component 11 after injection molding, and the increase in the resistance value will greatly limit its application range

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  • Over-current protection apparatus and its manufacturing method

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Embodiment Construction

[0067] 2(a) to 2(g) are schematic diagrams of the manufacturing method of the overcurrent protection device according to the first preferred embodiment of the present invention. Referring to FIG. 2( a ), firstly, a carrier substrate 20 is provided, which includes an insulating layer 201 and two first electrode layers 202 . In this embodiment, the insulating layer 201 is made of polyimide or polyester, and is stacked between the two first electrode layers 202 . In addition, roughening treatment may be performed on the surface of the first electrode layer 202 to increase surface adhesion. Referring to FIG. 2( b ), the carrier substrate 20 , the positive temperature coefficient material layer 203 and the second electrode layer 204 are combined by injection molding. Referring to FIG. 2( c ), two through holes 205 are formed through the carrier substrate 20 , the positive temperature coefficient material layer 203 and the second electrode layer 204 by mechanical drilling or laser....

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Abstract

The invention relates to a over-current protective device and relative producing method, which comprises: first, preparing at least two supporting basic plates and at least one positive temperature-parameter material layer, while said support basic plate comprises two first electrode layers and one insulation layer between said two first electrode layers; then putting at least one positive temperature-parameter material layer between at least two support basic plates to be injection molded; preparing two conductive post through at least two support basic plates and at least one positive temperature-parameter material layer to conduct said first electrode layer; forming at least one insulation layer inside the support basic plate to separate said first electrode layer. The invention can avoid the increase of resistance and it can be made into thin over-current protective device to apply the miniaturized electric device.

Description

【Technical field】 [0001] The invention relates to an overcurrent protection device and a manufacturing method thereof, in particular to a thin overcurrent protection device and a manufacturing method thereof. 【Background technique】 [0002] In order to prevent the circuit from over-current (over-current) or over-temperature (over-temperature) over-current protection device, with the current widespread of portable electronic products (such as mobile phones, notebook computers, portable cameras and personal digital assistants, etc.) application, and its importance is becoming more and more obvious. [0003] The resistance value of the existing positive temperature coefficient (Positive Temperature Coefficient, PTC) component responds very sensitively to the temperature change. When the PTC component is in normal use, its resistance can maintain a very low value, so that the circuit can operate normally. However, when the temperature rises to a critical temperature due to an o...

Claims

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Application Information

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IPC IPC(8): H01C7/02H01C17/00H01C17/06
Inventor 马云晋林承贤余锦汉
Owner POLYTRONICS TECH