Three-dimensional circuit module and method of manufacturing the same

A technology of three-dimensional circuit and manufacturing method, which is applied in the direction of printed circuit manufacturing, circuit, printed circuit, etc., can solve the problems of becoming complicated, lengthening the manufacturing process, increasing manufacturing cost, etc., and achieve the effect of reducing manufacturing cost

Inactive Publication Date: 2006-08-23
ALPS ALPINE CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, in the case of such a manufacturing method, the manufacturing process becomes longer and more complicated, so there is a problem that the manufacturing cost increases.

Method used

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  • Three-dimensional circuit module and method of manufacturing the same
  • Three-dimensional circuit module and method of manufacturing the same
  • Three-dimensional circuit module and method of manufacturing the same

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Embodiment Construction

[0046] Hereinafter, the three-dimensional circuit module and its manufacturing method according to the present invention will be described in detail with reference to the drawings. In addition, the dimension, material, etc. of each part illustrated in the following description are an example, and this invention is not necessarily limited to the following dimension, material, etc. FIG.

[0047] Adopt the three-dimensional circuit module of the present invention, such as figure 1 The three-dimensional sensing module 1 is shown. The three-dimensional sensing module 1 forms a three-dimensional wiring circuit on the surfaces of the wiring substrates 2 and 3 with a three-dimensional structure, and through figure 1 Three magnetic sensors 4x, 4y, and 4z that have sensing functions in one axis are respectively arranged in the three axes of the X, Y, and Z axes shown in , so as to form a three-dimensional sensing module.

[0048] Specifically, as figure 1 and figure 2 As shown, the...

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Abstract

A three-dimensional circuit module has a three-dimensional structure in which a second board is bonded to a first board at a predetermined angle. The first board has a first notched concave part formed at an edge to be a bonding surface S1 and a second notched concave part formed at an edge of the first notched concave part in the depth direction thereof. The second board has an electronic component mounted on a surface thereof opposite to the bonding surface of the first board and is engaged with the first notched concave part in a state in which the electronic component is disposed in the second notched concave part.

Description

technical field [0001] The present invention relates to a three-dimensional circuit module in which electronic components are mounted on a wiring board having a three-dimensional structure, and a method for manufacturing the same. Background technique [0002] In recent years, three-dimensional circuit modules in which wiring circuits are three-dimensionally formed on the surface of a substrate having a three-dimensional structure and electronic components, functional elements, etc. are mounted thereon have been proposed. For example, in a three-dimensional sensing module, a three-dimensional wiring substrate having two planes perpendicular to each other is prepared, and on this substrate, among three magnetic sensors having a sensing function along one axis, X, Two magnetic sensors for induction in the Y-axis direction are arranged on one surface, and one magnetic sensor for induction in the Z-axis direction is arranged on the other surface, so that it is not limited to the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/14H05K3/02H05K3/10H01L23/00
CPCH05K3/403H01L2924/01082H05K3/366H05K1/182H01L2924/01079H01L2924/01018H05K2201/10446H05K2201/09145H05K1/141H01L2924/01033H01L2924/01006H01L2924/01029H01L23/13H01L2924/01078H01L23/49833H01L2224/16225H05K3/0052H01L24/97H05K2201/048H01L2224/97H01L2924/14H01L2224/81H01L2924/00
Inventor 宫泽聪
Owner ALPS ALPINE CO LTD
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