Unlock instant, AI-driven research and patent intelligence for your innovation.

Electronic device and its electrical property connection structure

A technology for electrical connection and electronic devices, applied to electrical components, magnetic field/electric field shielding, structural components of record carriers, etc., can solve the problems of reduced contact area, easy deformation, shape and uncontrollable coating of adhesive, etc.

Inactive Publication Date: 2006-09-06
BENQ CORP
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, under such a configuration, after passing through the tin furnace, the solder of the pad 20 will form a solder bump (solder bump)
Since the surface of the solder bump is arc-shaped, the contact area between the conductive cotton body 30 and the pad 20 is reduced, on the one hand, the electrical contact between the conductive cotton body 30 and the pad 20 is deteriorated (that is, the efficiency of releasing electromagnetic interference signals worse), on the other hand, the conductive cotton body 30 is not easy to stick on the welding pad 20
[0004] In order to solve the above problems, we can mainly proceed from two aspects. One is to change the shape of the conductive cotton body 30 or the coating of viscose, but since the conductive cotton body 30 is a soft material that is easily deformed, its shape and viscose The coating of glue is not easy to control, so the reliability of this method is not high

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic device and its electrical property connection structure
  • Electronic device and its electrical property connection structure
  • Electronic device and its electrical property connection structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] Such as image 3 , Figure 4 As shown, in the electrical connection structure of the present invention, a plurality of solder pads 200 are provided on the printed circuit board assembly 100 , and in this embodiment, the solder pads 200 are long strips arranged in parallel. The top surface of the conductive cotton body 300 is in contact with the metal casing (not shown) of the optical drive, while the bottom surface is pasted on the welding pad 200. In this way, the overall contact between the conductive cotton body 300 and the welding pad 200 can be increased. The contact area, whereby the adhesive area 320 on the conductive cotton body 300 and the bonding pad 200 increases, so that the conductive cotton body 300 can be more firmly bonded to the welding pad 200, while the conductive cotton body 300 The contact area between the conductive region 340 and the pad 200 increases to make the electrical connection between the two more reliable.

[0021] In this embodiment, s...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

This is an electronic installation and its electric-connection structure. The electric-connection structure comprises a metal member, a conductive cotton body, a circuit board and a plurality of solder pads. Wherein: The solder pads are arranged on the circuit board, and the conductive cotton body comprises a first side and a second side. The first side contacts to the metal member and the second side contacts to the solder pads, so the metal member and the circuit board is electric connected.

Description

technical field [0001] The present invention relates to a structure for electrical connection, in particular to a structure for electrically connecting a plurality of welding pads with conductive cotton. Background technique [0002] In general optical drives, a conductive sponge is often used to guide the signal that generates electromagnetic interference from a special component of the printed circuit board assembly (PCBA) to the metal case of the optical drive (as a grounding terminal) and released. A solder pad is provided on the printed circuit board assembly for electrical connection with the conductive cotton. [0003] Such as figure 1 As shown, a welding pad 20 is arranged on the printed circuit board assembly 10 of a conventional optical drive, and the bottom surface of the conductive cotton body 30 is adhered on the welding pad 20, while the top surface of the conductive cotton body 30 is in contact with the casing of the optical drive ( not shown) contacts. Su...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G11B33/00G11B33/14H05K9/00
Inventor 徐晓滨
Owner BENQ CORP
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com