Thermal interface material and its production method

Abstract

The invention discloses a heat interfacial material and preparing method, which composes of one polymer material and many carbon nanometer pipes spreading in polymer material, wherein the polymer material comprises the first surface and the second surface; the carbon nanometer pipes entend to the first surface and the second surface of heat interfacial material.

Description

【Technical field】 [0001] The invention relates to a thermal interface material and a preparation method thereof, in particular to a thermal interface material with carbon nanotubes and a preparation method thereof. 【Background technique】 [0002] In recent years, with the rapid development of the integration process of semiconductor devices, the degree of integration of semiconductor devices has become higher and higher, while the volume of devices has become smaller and smaller, and its heat dissipation has become an increasingly important issue. The requirements are also getting higher and higher. In order to meet these needs, various heat dissipation methods have been widely used, such as fan heat dissipation, water cooling auxiliary heat dissipation and heat pipe heat dissipation, etc., and a certain heat dissipation effect has been achieved. However, due to the uneven contact interface between the heat sink and the semiconductor integrated device, Generally, less than ...

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Problems solved by technology

Therefore, there is a layer of polymer material with relatively high thermal resistance between the thermal conduction path formed by carbon nanotubes and the thermal contact surface, which leads to an increase in the thermal resistance of the entire thermal interface material and unsatisfactory thermal conductivity.

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