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Memory module with different types of multi chip packages

A multi-chip packaging, storage module technology, applied in static storage, packaging item types, non-removable covers/covers, etc., can solve problems such as hard disk shock fragility

Active Publication Date: 2006-09-27
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Also, in portable computers, nonvolatile memory, which is highly resistant to external shocks, is used to store data instead of hard disks, which are vulnerable to shocks

Method used

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  • Memory module with different types of multi chip packages
  • Memory module with different types of multi chip packages
  • Memory module with different types of multi chip packages

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Experimental program
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Embodiment Construction

[0016] The present invention will now be described more fully with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. Like reference numbers in the drawings indicate like elements.

[0017] figure 2 is a diagram illustrating a memory module according to an embodiment of the present invention.

[0018] In the memory module 20, different kinds of multi-chip packages (MCPs) are mounted on the PCB 23 according to the present invention. One type of MCP is a multi-chip package 21 that includes a NAND type flash memory 24 and a NOR type flash memory 25 . Another type of multi-chip package is multi-chip package 22 , which includes DRAM 26 and unit transistor RAM (UtRAM) 27 . These are just a few examples of possible packaging combinations in embodiments of the invention.

[0019] In one embodiment, according to figure 2 In the present invention shown, a multi-chip package 21 is a multi-chip package consisting only of non-volatile ...

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PUM

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Abstract

In an embodiment, a memory module includes a first group of multi chip packages, including one or more non-volatile memories, and a second group of multi chip packages, including one or more volatile memories, wherein the first and second groups of multi chip packages are electrically connected to a substrate. Various types of memory packages can be integrated into a single module that is mounted to the substrate, such as a printed circuit board, for improved size efficiency.

Description

technical field [0001] The present invention relates to a semiconductor memory module, and more particularly to a memory module with different types of multi-chip packages, which can be used as a replacement for a hard disk and a memory in a small computer. Background technique [0002] Figure 1A with 1B is a diagram showing a general storage module. Figure 1A is a top view of a general storage module, while Figure 1B for the front view. [0003] refer to Figure 1A with 1B , in a general memory module, a single kind of memory chip 11 is mounted on a printed circuit board (PCB) 12 . In the memory module, the memory chip 11 may be mounted on one or both surfaces of the PCB 12 . Furthermore, the memory 13 built inside each memory chip 11 may be a volatile memory such as DRAM or SRAM or a nonvolatile memory such as NAND flash memory or NOR flash memory. [0004] Conventionally, only a DRAM chip, an SRAM chip, or a flash memory type chip is mounted to one memory module b...

Claims

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Application Information

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IPC IPC(8): H01L25/18H01L23/48
CPCG11C5/02H05K1/181H01L25/18H01L2924/0002H01L2924/00A01G7/06A01G13/0237B65D43/16B65D85/52
Inventor 李昌焕
Owner SAMSUNG ELECTRONICS CO LTD