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Cavity cleaning method for semiconductor etching equipment

A technology for etching equipment and semiconductors, applied in the direction of cleaning methods using gas flow, cleaning methods and utensils, semiconductor/solid-state device manufacturing, etc., can solve the problems of expensive molecular pumps, reduce the service life of molecular pumps, etc., and achieve reduced time , to ensure normal operation and reduce damage

Active Publication Date: 2006-10-18
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The disadvantage of this is: since the two ends of the molecular pump are isolated by the swing valve, the molecular pump isolation valve, and the molecular pump cleaning valve
This greatly reduces the service life of the molecular pump, which is a very expensive component

Method used

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  • Cavity cleaning method for semiconductor etching equipment
  • Cavity cleaning method for semiconductor etching equipment
  • Cavity cleaning method for semiconductor etching equipment

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Embodiment Construction

[0027] The specific implementation of the chamber cleaning method for semiconductor etching equipment of the present invention will be further described in detail below in conjunction with the accompanying drawings, but it is not used to limit the protection scope of the present invention.

[0028] see figure 1 , the etching equipment chamber cleaning method proposed by the present invention, wherein, there are 6 valves around the reaction chamber, which are respectively an inflation valve 1, a side pumping slow valve 2, a side pumping block valve 3, a swing valve 4, and a molecular pump isolation valve 5. Molecular pump cleaning valve 6, these valves are used to control the air flow in the chamber and provide a certain load for the molecular pump 9; in addition, it is necessary to use a pressure sensor A in the chamber to determine how much gas is filled in the inflation valve, whether it is Reaching a sufficient air pressure, that is, how much it can evenly dilute the pollut...

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Abstract

The present invention relates to cleaning method for cavity of semiconductor etching equipment. The cleaning method includes measuring the pressure inside the reaction cavity, and controlling the opening and closing of the valves to the cavity so as to certain pressure inside the molecular pump and reduce the molecular pump isolating time. The present invention has less damage to the molecular pump and prolonged life of the molecular pump.

Description

technical field [0001] The invention relates to a cleaning method for semiconductor etching equipment, in particular to an improved chamber cleaning method for etching equipment. Background technique [0002] In the manufacture of semiconductor devices, the different material layers on integrated circuits or flat panel displays are typically formed by chemical and physical deposition or etching. Broadly speaking, etching technology includes uniform removal of the entire surface of the material, or selective removal of patterned parts. Etching is generally performed in a chamber in a plasma process system. [0003] The chamber cleaning method of the etching equipment is used for removing the pollution particles in the chamber and improving the quality of the product. The conventional cleaning method is the breathing cleaning method, that is, a certain amount of gas is filled into the chamber, and then the gas in the chamber is pumped out, and the pollutants are also sucked ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B5/00H01L21/00H01L21/3065
Inventor 杨荣辉
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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