High frequency bypass unit
A bypass device, high-frequency technology, applied in systems using filtering and bypassing, line transmission components, impedance networks, etc. The effect of improving the extraction efficiency and injection efficiency
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Embodiment approach 1
[0021] figure 1 是表示作为本发明的实施方式1的高频旁路装置的设备配置图。 figure 2 yes means figure 1 中所示的高频旁路装置的电路结构的等效电路图。此外,在本实施方式1以及以后表示的各实施方式中,为了容易理解本发明,以利用电力线传送高频信号的电力线通信举例来进行说明。
[0022] exist figure 1 中,在配电线1、2和配电线3、4之间设置了成为通信障碍的配电设备5。配电设备5为配电盘、杆式变压器以及电容器组等。 figure 1 中表示的高频旁路装置构成为绕过该配电设备5而使一端侧的配电线1、2和另一端侧的配电线3、4高频连接从而形成高频信号的通信路径。
[0023] 即,将分裂型铁芯6a、6b分别夹持在配电设备5的一端侧的配电线1、2上来进行设置,另外,将分裂型铁芯7a、7b分别夹持在配电设备5的另一端侧的配电线3、4上来进行设置,并利用连通到各个铁芯的电缆8来连接铁芯6a、6b和铁芯7a、7b。由此,铁芯6a、6b、7a、7b分别发挥作为变压器的功能。另外,在配电设备5和配电线1、2的连接端之间设置电容器9a,在配电设备5和配电线3、4的连接端之间设置电容器9b。
[0024] thereby, figure 1 中表示的高频旁路装置的电路结构成为如 figure 2 as shown. exist figure 2 中,在配电设备5的一端侧上,配电线21一端被连接到外部,另一端经铁芯6a形成的变压器T1的一侧的输入输出侧线圈被连接到配电线23的一端,而配电线23的另一端则被连接到配电设备5的一端侧的连接点A1上。 Above are figure 1 中所示的配电线1和铁芯6a之间的关系。
[0025] 另外,配电线22其一端被连接到外部,另一端经铁芯6b形成的变压器T2的一侧的输入输出侧线圈被连接到配电线24的一端,而配电线24的另一端则被连接到配电设备5的一端侧的连接点A2上。 Above are figure 1 中所示的配电线2和铁芯6b之间的关系。
[0026] 同样地,在配电设备5的另一端侧,配电线27其一端被连接到外部,另一端经铁芯7a形成的变压器T3的一侧的输入输出侧线圈被连接到配电线25的一端,而配电线25的另一端则...
Embodiment approach 2
[0052] image 3 It is a device layout diagram showing a high-frequency bypass device according to Embodiment 2 of the present invention. Figure 4 yes means image 3 The equivalent circuit diagram of the circuit configuration of the high-frequency bypass device shown in . Moreover, in image 3 with Figure 4 in, right with figure 1 with figure 2 The constituent elements shown in (Embodiment 1) are the same or corresponding constituent elements are given the same reference numerals. Here, the description will focus on the part related to the second embodiment.
[0053] That is, if image 3 As shown, in the high-frequency bypass device according to Embodiment 2, in figure 1 In the structure shown in (Embodiment 1), split-type iron cores 11a, 11b are provided instead of split-type iron cores 6a, 6b on distribution lines 1, 2. In addition, on the distribution lines 3 and 4, split-type iron cores 12a and 12b are provided instead of the split-type iron cores 7a and 7b. In...
Embodiment approach 3
[0079] Figure 5 It is a device layout diagram showing a high-frequency bypass device according to Embodiment 3 of the present invention. Image 6 yes means Figure 5 The equivalent circuit diagram of the circuit configuration of the high-frequency bypass device shown in . In addition, in Figure 5 with Image 6 in, right with figure 1 with figure 2 The constituent elements shown in (Embodiment 1) are the same or corresponding constituent elements are given the same reference numerals. Here, the description will focus on the parts related to Embodiment 3. FIG.
[0080] That is, if Figure 5 As shown, in the high-frequency bypass device according to Embodiment 3, in figure 1 (Embodiment 1) Of the distribution lines 1 and 2 of the structure shown in the distribution line, a split-type iron core that functions as a transformer is provided on one of the distribution lines, and a split-type iron core that functions as a transformer is not disposed on the other distribution...
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