Portable electronic device
An electronic device, portable technology, applied in the direction of circuit heating device, electrical components, electrical digital data processing, etc., can solve the problems of endangering user safety, increasing danger, easily damaging electronic components and light-emitting components, etc., to reduce the internal Temperature, the effect of avoiding high temperature explosion
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no. 1 example
[0015] refer to Figure 1a , which shows an exploded view of the portable electronic device 100 according to the first embodiment of the present invention, including the casing 10 , the circuit board 20 , the heat conduction structure 30 , the heat dissipation structure 40 and the control interface 50 . The housing 10 is composed of a first housing part 11 and a second housing part 12 , and the circuit board 20 and the heat conducting structure 30 are disposed in the housing 10 . The heat conducting structure 30 is disposed on the circuit board 20 and has a screw hole 31 . The heat dissipating structure 40 is a cover with a hinged portion 41 . collocation reference Figure 1b When the portable electronic device 100 is combined, the bolt 42 passes through the pivot portion 41 and the casing 10, and is locked into the screw hole 31 of the heat conduction structure 30, so that the heat dissipation structure 40 is pivotally connected to the heat conduction structure 30.
[0016...
no. 2 example
[0021] refer to Figure 4a , which shows an exploded view of the portable electronic device 100' according to the second embodiment of the present invention. The difference between it and the first embodiment is that the heat conduction structure 30' is fixed to the circuit board in a locking manner through bolts 33 20 or more. refer to Figure 4b , the bolts 33 pass through the plate 22 and contact the heat conducting layer 21 . Therefore, the heat generated by components such as chipsets and light-emitting elements on the circuit board 20 can pass through the plate 22 to the heat-conducting layer 21, and pass through the heat-conducting layer 21 and the bolts 33 to the heat-conducting structure 30'.
[0022] Compared with the first embodiment, the manufacturing process of the second embodiment of the present invention is simpler and the assembly is easier, so the manufacturing cost is lower.
[0023] Although in the above-mentioned first and second embodiments, the heat d...
no. 3 example
[0025] refer to Figure 5a , which shows a portable electronic device 200 according to the third embodiment of the present invention, which is a slide-type mobile phone and includes a casing 10', a circuit board 20, a heat conducting structure 30, a heat dissipation structure 40' and a control interface 50'. The control interface 50' is disposed on the casing 10'. The casing 10' includes a sliding cover 11' and a body 12'. The main body 12' has a sliding groove 122, so that the sliding cover 11' is slidably connected to the main body 12'. The circuit board 20 and the heat conducting structure 30 are disposed in the body 12'. The heat dissipation structure 40' is disposed on the surface of the sliding cover 11'.
[0026] refer to Figure 5b , in the third embodiment, the top of the heat conduction structure 30 is exposed on a first surface 121 of the body 12', and the heat dissipation structure 40' is disposed on a second surface 111 of the sliding cover 11'. The top of th...
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