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Optical data communication module

A communication module and data communication technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve problems such as waste

Inactive Publication Date: 2007-01-17
ROHM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In contrast, in the above-mentioned infrared data communication module 9, the infrared rays emitted from the side of the light-emitting element 92 to the periphery of the light-emitting element 92 do not travel toward the lens portion 91a, resulting in wasted
Therefore, there is still room for improvement on this point

Method used

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  • Optical data communication module
  • Optical data communication module
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Examples

Experimental program
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Embodiment Construction

[0017] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

[0018] figure 1 and figure 2 The shown infrared data communication module 1 includes: a substrate 2 , a light-emitting element 3 that generates infrared rays, a light-receiving element 4 that can sense and receive infrared light, an IC chip 5 , and a sealing resin package 6 . The light emitting element 3 , the light receiving element 4 and the IC chip 5 are mounted on the surface 2 a of the substrate 2 . The light emitting element 3 , the light receiving element 4 , and the IC chip 5 are covered by a resin package 6 .

[0019] The substrate 2 is an insulating substrate made of glass epoxy resin or the like, and has a long rectangular shape in plan view. On the surface 2a of the substrate 2, circuit patterns (not shown) for supplying electric power to the light emitting element 3, the light receiving element 4, and the IC chip 5 and inputting and...

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PUM

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Abstract

Disclosed is an infrared data communication module ( 1 ) comprising an infrared light-emitting device ( 3 ), an infrared light-receiving device ( 4 ) and an IC chip ( 5 ). The light-emitting device ( 3 ), light-receiving device ( 4 ) and IC chip ( 5 ) are mounted on a substrate ( 2 ) and covered with a sealing resin package ( 6 ). The substrate ( 2 ) is provided with a recessed portion ( 22 ) whose innner surface is covered with a ground-connected metal film ( 7 ), and the light-emitting device ( 3 ) is arranged in the recessed portion ( 22 ).

Description

technical field [0001] The present invention relates to an optical communication module, particularly an infrared data communication module, installed in a personal computer, its peripheral equipment, or a mobile phone. Background technique [0002] Figure 4 An example of a conventional infrared data communication module is shown. The illustrated infrared data communication module 9 has a substrate 90 on which a light emitting element 92 , a light receiving element 93 , and an IC chip 94 are mounted on a surface 90 a , and these components are covered with a sealing resin package 91 . The resin package 91 has a first lens portion 91a for concentrating infrared rays emitted from the light emitting element 92 to improve directivity, and a second lens portion 91b for increasing light receiving sensitivity by concentrating infrared rays traveling from the outside on the light receiving element 93 . The IC chip 94 performs drive control of the light emitting element 92 , signa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/02H01L31/12H01L25/16H01L31/0203H01L31/0232
CPCH01L31/0203H01L25/167H01L2224/48465H01L33/46H01L2924/3025H01L31/0232H01L31/02325H01L31/02327H01L2224/48091H01L2924/00014H01L2924/00H01L23/02H01L31/12
Inventor 堀尾友春
Owner ROHM CO LTD