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Single-process-chamber deposition system

A processing chamber and deposition technology, applied in the field of deposition systems, can solve problems such as limiting the application of deposition system 200, and achieve the effects of improving production volume and use efficiency, low cost, and small footprint

Inactive Publication Date: 2007-01-24
ASCENTOOL
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

Deficiencies in cost and size limit the application of the deposition system 200

Method used

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  • Single-process-chamber deposition system
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Embodiment Construction

[0047] The present invention addresses the above shortcomings of prior art systems by providing a compact single chamber deposition system capable of depositing multilayer structures on substrates while eliminating or reducing the number of pump downs. Such as image 3 with 4 As shown, deposition system 300 includes a single process chamber 310 , a workpiece holder 320 that can hold a workpiece 330 , a support plate 340 , a plurality of targets 350 and 351 , and a magnet 360 . Workpiece 330 may include silicon wafers, glass substrates, optical disks, and the like. Deposition system 300 also includes a vacuum pump that can draw air from the process chamber until the pressure is substantially below atmospheric pressure. Deposition system 300 may include two, three, four, five, six or more targets, which is flexible for multi-layer deposition including different materials.

[0048]In contrast to prior art systems (e.g., deposition system 200) that include multiple magnetron so...

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Abstract

A deposition system includes a processing chamber, a workpiece holder for holding a workpiece in the processing chamber, a first target containing a first material, a second target containing a second material, a single magnet assembly, and a transfer mechanism, the single magnet assembly Arranged to sweep across the first target and the second target to deposit the first material and the second material on the workpiece, the transfer mechanism can cause relative movement between the magnet assembly and the first or second target.

Description

technical field [0001] The present application relates to deposition systems for depositing materials on substrates. Background technique [0002] In microfabrication technology, physical vapor deposition (PVD) is a common process. refer to Figure 1A with 1B , the deposition system 100 includes a process chamber 110 , a workpiece holder 120 capable of holding a workpiece 130 , a target 150 and a magnetron sputtering source 160 . Target 150 may include material to be sputtered by magnetron sputtering source 160 and deposited on workpiece 130 . The workpiece holder 120 and workpiece 130 are generally stationary within the processing chamber 110 during deposition. A magnetron source is placed adjacent to each target. The target is supported by a backing plate which internally includes a cooling system which may be cooling water pipes in the backing plate or a cooling liquid bath in which the entire magnetron 160 and target 150 are immersed. ). During deposition, the magn...

Claims

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Application Information

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IPC IPC(8): C23C14/34C23C14/56C23C14/54
CPCH01J37/3473C23C14/352H01J37/3408H01J37/3455
Inventor 郭信生
Owner ASCENTOOL
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