Radiating module and electronic device for collecting dust on radiating fin by vibration

A technology of heat dissipation fins and heat dissipation modules, which is applied in the fields of electrical digital data processing, instruments, digital data processing components, etc., can solve problems such as thermal freeze, affecting the functional operation and computing speed of notebook computers, etc.

Active Publication Date: 2007-04-04
ASUSTEK COMPUTER INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to provide a heat dissipation module that uses vibration to remove dust on the heat dissipation fins, so as to solve the problem that if the heat generated by the internal components of the notebook computer cannot be efficiently removed, it will affect the functional operation and calculation of the notebook computer speed or a condition that may produce a so-called thermal freeze

Method used

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  • Radiating module and electronic device for collecting dust on radiating fin by vibration
  • Radiating module and electronic device for collecting dust on radiating fin by vibration
  • Radiating module and electronic device for collecting dust on radiating fin by vibration

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Embodiment Construction

[0013] Please refer to FIG. 3 . FIG. 3 is a schematic view of the internal components of an electronic device 50 of the present invention. The electronic device 50 includes a housing 52 for covering the internal components. An air outlet 56 is provided on the side of the housing 52 . The device 50 further includes a heat dissipation module 58, which includes a fan 60 installed above an air inlet (not shown in the figure), and a base 62 installed between the fan 60 and the air outlet 56 of the housing 52 . The base 62 can be a heat sink, and a plurality of heat dissipation fins 64 are disposed on the base 62 to increase the surface area for heat dissipation. The fan 60 of the cooling module 58 can inhale outside air through the air inlet, and output the inhaled air to a plurality of cooling fins 64 on the base 62, and finally discharge it through the air outlet 56, so as to dissipate the air contained in the internal components of the electronic device 50. The generated heat i...

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Abstract

A heat radiating module utilizing vibration mode to remove off dust on heat radiation fin is prepared as setting multiple heat radiation fin on base and setting a vibrating unit on base for using said vibrating unit to vibrate said multiple heat radiation fin in order to remove dust on those fins off.

Description

technical field [0001] The invention relates to a heat dissipation module, in particular to a heat dissipation module which uses vibration to remove dust on heat dissipation fins. Background technique [0002] In today's modern information society, the computer system has become one of the indispensable information tools for most people. Regardless of whether it is a desktop personal computer, a notebook personal computer or a server, etc., its operating clock is getting higher and higher, and the application The levels are also getting wider. Today's notebook computers are developing towards thinner and lighter. However, with the advancement of technology, the functions of notebook computers are becoming more and more powerful, so the heat generated when performing various functions is also relatively increased. This is caused by If the heat generated by the internal components of the notebook computer cannot be efficiently removed, it will affect the functional operation ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
Inventor 叶青松
Owner ASUSTEK COMPUTER INC
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