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Method of resin-seal molding electronic component and apparatus therefor.

A technology for resin sealing and electronic components, which is applied to electrical components, electrical solid devices, circuits, etc., can solve the problems of uneconomical, large amount of resin, and unsimplified metal mold structure, achieve simple structure, suppress the generation of waste resin, The effect of easy mold maintenance work

Inactive Publication Date: 2007-04-04
TOWA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the basic metal mold structure is not simplified
In addition, the amount of resin cured at these parts (the amount of discarded resin) is large and uneconomical.

Method used

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  • Method of resin-seal molding electronic component and apparatus therefor.
  • Method of resin-seal molding electronic component and apparatus therefor.
  • Method of resin-seal molding electronic component and apparatus therefor.

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0075] FIG. 1 schematically shows the overall configuration of a resin sealing molding device.

[0076] This resin sealing and molding apparatus includes: a resin sealing and molding unit 100 for resin sealing and molding an electronic component on a substrate; for transporting and supplying a substrate before resin sealing and molding to a predetermined position described later in the resin sealing and molding unit; a substrate supply and take-out mechanism 200 for taking out the resin-encapsulated substrate from the resin-encapsulation-molding section; Agency 300.

[0077] The resin sealing and molding part 100 includes: a mold 110 for resin sealing and molding electronic components; a mold opening and closing mechanism 120 for opening and closing the mold; A pressurizing mechanism (Japanese: press frame) 130 for applying the necessary clamping pressure to the mold; a feeding block (Japanese: potuto block) 140 arranged on the side of the mold 110 for supplying resin materia...

Embodiment 2

[0125] 15 to 17 show a resin sealing molding apparatus according to another embodiment of the present invention. The difference between this apparatus and the resin sealing molding apparatus of the above-mentioned first embodiment is as follows.

[0126] That is, in the resin sealing and molding apparatus of the first embodiment, a resin sealing area (see FIG. 7 ) for resin sealing electronic components is provided on one main surface of a substrate 400, but in FIG. In the resin sealing molding device of this embodiment, there are multiple resin sealing areas (two in the illustration). In addition, the device of this embodiment is similar to the first embodiment in terms of being provided with the feeding chamber 141 for supplying the resin material, the push rod 142 for pressurizing the resin material, and the reciprocating drive mechanism 143 for the push rod, etc. The device of one embodiment is different.

[0127] In addition, the device shown in FIG. 16 is basically the ...

Embodiment 3

[0131] 18 and 19 show a resin sealing molding apparatus according to another embodiment of the present invention, which is a modified example of the second embodiment shown in FIGS. 15 and 16 above.

[0132] Although the number of processed resin-sealed molded products can be increased by using the device of the second embodiment shown in Figure 15 and Figure 16, the device of the third embodiment shown in Figure 18 and Figure 19 can further increase the number of resin-sealed molded products mentioned above. The processing quantity of molded products.

[0133] In the device shown in FIG. 18, the device of the second embodiment shown in FIG. 15 is symmetrically arranged in the figure. In the device shown in FIG. The devices are arranged bilaterally symmetrically.

[0134] In addition, in the apparatus of the third embodiment, the mold clamping pressure described above is applied to each of the molds 110 arranged bilaterally symmetrically. Therefore, it is set so that the res...

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Abstract

A mold (110) for resin-seal-molding an electronic component is constituted by a first mold (111) and a second mold (112). At a mold face (PL face) of the molds, a substrate supply-set surface (113) having a flat shape without a step is provided. A pot block (140) is joined with and separated from a side position (110a) of the mold (110) intersecting perpendicularly with the mold face (PL face) of the molds. In a state where the mold face and the pot block (140) are joined, a molten resin material in the pot block (140) is injected into a cavity (114). The overall structure of the mold (110) for resin-seal-molding an electronic component mounted on the substrate (400) is simplified. Additionally, when resin-seal-molding the electronic component, a problem of variation in the thicknesses of the substrates (400) is solved. Thus, resin flash formation on the substrate surface is prevented.

Description

technical field [0001] The present invention relates to a method of sealing and molding relatively small electronic components such as semiconductor chips with a resin material, and a resin sealing and molding apparatus for electronic components used for carrying out the method. Background technique [0002] In particular, in recent years, higher functionality has been demanded for semiconductor packages (hereinafter simply referred to as "semiconductor packages") in which relatively small electronic components such as semiconductor chips (hereinafter simply referred to as "electronic components") are sealed and molded with a resin material. Specifically, for example, such as a so-called molded array package (Japanese: map) type large substrate, etc., there are strong demands for high integration, high reliability, and miniaturization (that is, light, thin, short, and small). [0003] Therefore, when molding a semiconductor package, it is necessary to resin-seal and mold the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56B29C45/14
CPCH01L2924/0002H01L21/67126H01L21/565H01L2924/00
Inventor 前田启司
Owner TOWA
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