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Peeling device and peeling method

A technology of peeling device and peeling sheet, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., and can solve the problems of wafer damage, residue, application, etc.

Active Publication Date: 2007-04-11
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that the adhesive 101 of the protective sheet S remains between the protrusions 100
[0007] In addition, in the sheet peeling device disclosed in the above-mentioned patent document, the peeling tape is attached while rotating while the roller for peeling is applying a pressing force to the wafer surface, and then peeled while pressing the wafer surface in the same way, so the peeling of the sheet is simultaneously performed. Resistance and pressing force, which become the load applied to the wafer, there is a problem of causing damage to the wafer

Method used

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  • Peeling device and peeling method
  • Peeling device and peeling method
  • Peeling device and peeling method

Examples

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Embodiment Construction

[0041] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0042] FIG. 1 is a schematic front view of a sheet peeling device according to this embodiment. In this figure, the sheet peeling device 10 has a table 11 for peeling and a sheet peeling unit 12 . The detachment table 11 supports the wafer W as a detachment object, and the sheet detachment unit 12 is disposed on the upper portion of the detachment table 11 facing each other.

[0043] The wafer W is not particularly limited, and is supported by the ring frame RF via a mounting tape MT and a bonding sheet (die bonding sheet) DS, and a protective sheet S is attached to the circuit surface side of the wafer W (upper side in FIG. 1 ). The protective sheet S is not particularly limited, and is attached via an ultraviolet curable adhesive in the present embodiment.

[0044]The detachment table 11 is provided to be movable in the arrow direction A in FIG. 1 via guide rails, e...

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Abstract

A peeling apparatus (10) is provided with a peeling table (11) for supporting a wafer (W) whereupon a sheet (S) is adhered, and a sheet peeling unit (12) arranged on an upper part of the peeling table (11). In the peeling apparatus, the sheet peeling unit (12) and the peeling table (11) are relatively shifted and the sheet (S) can be peeled. The peeling apparatus is also provided with a supporting roll (20) for a peeling tape (PT), first and second rolls (30, 31) for adhering the peeling tape (PT) on the surface of the sheet (S), and a take-up roll (21) for the peeling tape (PT). Peeling is performed under a condition where an initial peeling angle (alpha1) is formed by bending the peeling tape (PT) in a space (C) formed between the second roll (31) and the sheet (S), and then, the sheet (S) is peeled at a subsequent peeling angle (alpha2) corresponding to a diameter of the second roll (31).

Description

technical field [0001] The present invention relates to a sheet peeling device and a peeling method, and particularly to a sheet peeling device and a peeling method suitable for peeling a protective sheet attached to a circuit surface of a semiconductor wafer. Background technique [0002] Conventionally, when grinding a semiconductor wafer (hereinafter simply referred to as "wafer") for ultra-thinning, a protective sheet is usually attached to the circuit side, and the protective sheet is removed after the assembly process of the ring frame is completed. to be stripped. When peeling off the protective sheet, special care is required because the wafer is very thin. [0003] Patent Documents 1 and 2 disclose a peeling device and a peeling method of the above-mentioned protective sheet. This document proposes a configuration in which a large peeling angle is ensured by combining a plurality of rollers, and the protective sheet is peeled in a direction as parallel as possible...

Claims

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Application Information

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IPC IPC(8): H01L21/304
CPCH01L2221/68395H01L2221/68386
Inventor 辻本正树吉冈孝久小林贤治
Owner LINTEC CORP