Substrate fixing clamp of magnetic sputtering instrument

Abstract

This invention relates to a technique area of fixture, particularly a substrate fixture of magnetron sputtering equipment. The substrate that is used to fix magnetron sputtering equipment includes: A cover glass of which main body is rectangle, one side of it has three square gaps, each of two sides has a through hole; A substrate support, is round, of which interior has two screw holes, its hole spacing concords with the hole spacing of through hole that is in cover glass; Substrate is putted under emargination of cover glass, and it is fixed between cover glass and substrate support by screw.

Description

technical field [0001] The invention relates to the technical field of fixing fixtures, in particular to a substrate fixing fixture for a magnetron sputtering apparatus. Background technique [0002] In recent years, with the rapid development of semiconductor technology, various growth methods of semiconductor materials have emerged as the times require. Magnetron sputtering technology has been widely used as a simple method, low cost and fast semiconductor thin film growth technology. The substrate is the substrate for the growth of semiconductor thin film materials, usually a crystalline substance, such as silicon, gemstones, gallium arsenide, etc.; it can also be an amorphous substance, such as glass, organic substances. The substrate is generally in the form of a thin sheet, and it needs to be fixed on the heating furnace of the magnetron sputtering apparatus during the growth process of the material. [0003] The more common method for fixing the substrate now is: th...

AI Technical Summary

Problems solved by technology

But its disadvantages are: firstly, since the position of the small iron pieces fixing the substrate is immutable, and the positions of each small iron piece are far apart, for a substrate with a small area, multiple iron pieces cannot be used. to fix it

Only one of the iron pieces can be used to clamp the substrate, which will inevitably cause the substrate to be not firmly fixed. During the loading and unloading process of the substrate being sent into the reaction chamber, it will become loose due to vibration, or even fall, resulting in Experimental failure

Secondly, when fixed with an iron sheet, it will inevitably cover part of the surface of the substrate. For a small substrate, the area itself is not large, so there are not many parts that can be used for sputtering coating, resulting in certain problems. Waste, and it is not conducive to the test analysis after film preparation

Images