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Light emitting device

A technology for light-emitting devices and light-emitting elements, which is applied to electrical components, electric solid-state devices, circuits, etc., can solve the problem of not considering the thinning of light-emitting devices, and achieve the effect of efficient extraction

Inactive Publication Date: 2011-05-11
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0020] In addition, in the technical solution disclosed in the above-mentioned Patent Document 2, it is not considered to realize thinning of the light-emitting device by forming the reflector into a flat shape.

Method used

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no. 1 Embodiment approach

[0049] Next, an embodiment of the light emitting device of the present invention will be described with reference to FIGS. 1 to 4 .

[0050] FIG. 1( a ) is a cross-sectional view showing a light emitting device according to this embodiment.

[0051] The light-emitting device of this embodiment is composed of a substantially rectangular parallelepiped package molding (hereinafter referred to as package 101 ) having a dish-shaped recess and an LED chip (hereinafter referred to as chip 102 ) shown in FIG. 2( a ).

[0052] The above-mentioned concave portion constitutes a reflector 103 including a bottom surface 103c and side walls provided obliquely along the periphery of the bottom surface. The reflector 103 can realize the function of the reflector by means of the reflective properties of the package 101 itself by using a white package, etc., or it can be processed separately, for example, by forming a reflective film on the side wall of the concave portion to increase the refl...

no. 2 Embodiment approach

[0093] Next, an embodiment of the light emitting device of the present invention will be described with reference to FIGS. 5 to 9 .

[0094] Fig. 5(a) is a cross-sectional view showing the light emitting device of this embodiment.

[0095]The light-emitting device of this embodiment consists of a substantially rectangular parallelepiped package molded body (hereinafter referred to as package 201 ) having a dish-shaped concave portion and a chip 202 (hereinafter referred to as junction-upchip) shown in FIG. 6( a ). In this configuration, an active layer as a light emitting portion is formed near the top surface of the chip 202 .

[0096] The above-mentioned concave part constitutes the reflector 203, and the reflector 203 includes a concave area and a slope disposed along the edge of the concave area.

[0097] The recessed area is composed of a bottom surface 203e and an upright surface 203a disposed approximately vertically along the periphery of the bottom surface 203e.

[...

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Abstract

The invention provides a light-emitting device composed of a light-emitting component and an approximate cuboid sealed molding body which receives the light-emitting component and forms a concave portion on a bottom face for carrying the light-emitting component, the concave portion is filled with a light transmission sealing resin for covering the light-emitting component, the surface of the sealing resin is used as a light emitting surface and light is emitted from the surface. The light-emitting device is characterised in that an active layer is provided between an approximate centre and neighborhood of a cell of the light-emitting component; the concave portion has a concave gegion in the sealed molding body; the concave portion contains a reflecting surface which is a slope provided along a short edge of the concave gegion to the light emitting surface; a microstrip region and a lead bonding region are provided at a bottom face of the concave gegion; the deepness of the concave gegion is approximately equal to the height of the active layer of the light-emitting component, or less than the height of the active layer.

Description

technical field [0001] The present invention relates to a semiconductor light-emitting device composed of a light-emitting element and a molded package, wherein a recess is formed in the molded package, and the recess accommodates the light-emitting element and functions as a reflector for guiding light to the outside. Background technique [0002] As a thin planar light source used in a liquid crystal display device or the like, for example, there is a thin planar light source in which a surface mount type light emitting device (hereinafter referred to as "light emitting device") is arranged on the end face side of a light guide plate, wherein, The light guide plate is disposed under the liquid crystal display. [0003] In the above-mentioned planar light source, the light guide plate and the light emitting device are arranged side by side on the mounting surface so that the end surface of the light guide plate faces the emission surface of the light emitting device, thereb...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L33/56H01L33/60H01L33/62
CPCH01L2224/48091H01L2224/73265
Inventor 伊藤晋
Owner SHARP KK