Cutting device
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- DISCO CORP
- Publication Date
- 2007-06-13
Smart Images
Figure 1 Figure 2 Figure 3
Abstract
Description
technical field
[0001] The present invention relates to a cutting device having a cutting blade, and more particularly to a cutting device having a function of detecting the state of chipping and wear of the cutting blade. Background technique
[0002] Wafers formed with multiple devices such as LCs and LSIs are cut vertically and horizontally by cutting blades rotating at high speeds, and are divided into individual chips for use in various electronic devices.
[0003] The above-mentioned cutting insert is mounted on a high-speed rotating spindle and used, and a cutting edge portion is formed on the outer periphery thereof. The cutting edge portion is formed by fixing abrasive grains made of diamond or the like by means of electroforming, metal bonding, or resin bonding. Therefore, cutting causes the cutting edge portion to deteriorate over time, causing chipping and wear, and there are defects caused by cutting. The problem that the quality of each device deteriorates. ...