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Clenaer of chemical-mechanical polisher head

A technology of chemical machinery and cleaning devices, which is applied in the direction of grinding/polishing equipment, grinding/polishing safety devices, grinding devices, etc., can solve the problems of reduced efficiency, increased cost, and inability to clean particles, so as to achieve increased working time, Improve the effect of working hours

Inactive Publication Date: 2007-06-20
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0018] But, there are some defects in this cleaning device of prior art: can't effectively clean the particle remaining at the gap 363 place of polishing head 36
[0021] In addition, due to the poor cleaning effect, the polishing head 36 must be removed from the equipment for a thorough cleaning after running for a period of time (after about polishing 400 wafers), resulting in increased cost and reduced efficiency

Method used

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  • Clenaer of chemical-mechanical polisher head
  • Clenaer of chemical-mechanical polisher head
  • Clenaer of chemical-mechanical polisher head

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Embodiment Construction

[0046] Please refer to FIG. 4 , which is a schematic diagram of a first embodiment of the cleaning device for the polishing head of the chemical mechanical polishing equipment of the present invention.

[0047] In this embodiment, the cleaning device includes a support 410 , a plurality of support nozzles 420 , a serpentine pipe 430 , a serpentine pipe nozzle 440 and a cleaning agent supply facility (not shown in the figure).

[0048] The bracket 410 is used to connect other components, including a vertical bracket tube 411 and a horizontal bracket tube 412 . The vertical support pipe 411 and the horizontal support pipe 412 are substantially cylindrical. The vertical support pipe 411 and the horizontal support pipe 412 are connected to each other.

[0049] A plurality of bracket nozzles 420 are arranged on the horizontal bracket pipe 412 for spraying cleaning agent to the polishing head 36 to clean it when it moves above the cleaning device after the polishing process.

[00...

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PUM

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Abstract

A cleaning apparatus for the polishing head of chemicomechanical polishing machine is composed of a detergent supplying unit, a supporting frame, several nozzles on said supporting frame, a gap cleaning nozzle for the gaps on polishing head, and a flexible connection device between said gap cleaning nozzle and supporting frame or detergent supplying unit.

Description

technical field [0001] The invention relates to equipment cleaning technology in the integrated circuit manufacturing process, in particular to a cleaning device for a polishing head of chemical mechanical polishing equipment. Background technique [0002] In the semiconductor process, as the size of components continues to decrease, the resolution of lithography exposure increases relatively, and with the reduction of exposure depth of field, the requirements for the level of fluctuations on the wafer surface are more stringent. Therefore, it is necessary to planarize the wafer. In the current semiconductor manufacturing process, the planarization process has become an indispensable step in wafer manufacturing. In the era of deep submicron or even nanometer, chemical mechanical polishing technology has gradually replaced the traditional etch-back (Etching Back) or spin-on glass (Spin-On Glass, SOG) cladding technology, and has become the mainstream of semiconductor planari...

Claims

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Application Information

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IPC IPC(8): B24B55/00B24B37/04H01L21/304B24B37/34
Inventor 李强李福洪姚宇李宁
Owner SEMICON MFG INT (SHANGHAI) CORP
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