Pressure resistance type soil stress sensor

A stress sensor, piezoresistive technology, which is applied in the field of silicon piezoresistive soil stress sensors, can solve the problems of piezoresistive pressure sensors that have not yet been applied, and achieve the effects of improving measurement accuracy, expanding the force-bearing area, and improving stability characteristics

Active Publication Date: 2007-06-27
KUNSHAN SHUANGQIAO SENSOR MEASUREMENT CONTROLLING
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Problems solved by technology

[0004] The silicon piezoresistive pressure sensor was born in the 1950s, and it began to be practical with the maturity of integrated circuit technology. With the development of its design technology, info

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  • Pressure resistance type soil stress sensor
  • Pressure resistance type soil stress sensor

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Embodiment Construction

[0035] Further description below in conjunction with accompanying drawing 1 to accompanying drawing 4:

[0036] A piezoresistive soil stress sensor is composed of a sensor housing 1, a stress-sensitive component 4 and an output cable 14. The front end of the sensor housing is welded with an elastic body 2 of a flat-film metal that can sense stress. Inside the sensor housing is formed a A fixed support step 20 with a hole 23 structure, the sensitive component is a silicon piezoresistive component, and is fixed on the end surface of the fixed support step, and the cavity formed between the elastic body 2 is filled with a grade A silicone oil pressure transmission medium 3, the The inner lead wire 5 of the sensitive component is externally connected to the outgoing cable 8 through the adapter plate 6 fixed at the rear end of the sensor housing, and the outgoing cable is externally connected to the output cable after passing through the signal conditioning circuit 13 .

[0037] Th...

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Abstract

The soil stress is composed of shell, stress-sensing module (SSM), and output cable. An elastic body capable of sensing stress is fixed at front end of shell of sensor. A clamped sidestep with structure of hole is formed inside the shell of sensor. Being fixed at end face of the clamped side step, SSM is silicon piezoresistance type module with structure of Wheatstone bridge. Fluid pressure medium for propagation is filled in a cavity formed between the end face of the clamped sidestep and the elastic body. Through an adapter plate, a lead out cable, a signal rectification circuit, the intraconnection of SSM is connected to the external output cable. Introducing mature silicon piezoresistance type sensing element to mechanics research area of soil stress, the invention fabricates piezoresistance type stress sensor. Features are: volume-produce by IC technique, good consistency and low frequency characteristic, simple signal process, and miniaturization.

Description

technical field [0001] The invention relates to a soil stress sensor, in particular to a silicon piezoresistive soil stress sensor. Background technique [0002] The so-called soil stress refers to soil (including soil, sand, concrete, mountains, dam foundations of dams, bridge foundations, road foundations, building foundations, etc.) Water storage, vehicles on the road, etc.), the stress generated inside it. With the development of science and technology, especially the development of the construction industry, people have great interest in the bearing capacity of soil and the interaction between soil and structures. This raises the question of how to measure soil stress accurately. [0003] Foreign countries began to study the measurement of soil stress as early as 1913, and later developed to the transportation, waterways, construction, bridges, engineering, universities and other departments of major countries have established related research institutions. Domestic ...

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Application Information

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IPC IPC(8): G01L1/18
Inventor 王文襄王善慈石桥李水侠许广军
Owner KUNSHAN SHUANGQIAO SENSOR MEASUREMENT CONTROLLING
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