Pressure resistance type soil stress sensor

Abstract

The soil stress is composed of shell, stress-sensing module (SSM), and output cable. An elastic body capable of sensing stress is fixed at front end of shell of sensor. A clamped sidestep with structure of hole is formed inside the shell of sensor. Being fixed at end face of the clamped side step, SSM is silicon piezoresistance type module with structure of Wheatstone bridge. Fluid pressure medium for propagation is filled in a cavity formed between the end face of the clamped sidestep and the elastic body. Through an adapter plate, a lead out cable, a signal rectification circuit, the intraconnection of SSM is connected to the external output cable. Introducing mature silicon piezoresistance type sensing element to mechanics research area of soil stress, the invention fabricates piezoresistance type stress sensor. Features are: volume-produce by IC technique, good consistency and low frequency characteristic, simple signal process, and miniaturization.

Description

technical field [0001] The invention relates to a soil stress sensor, in particular to a silicon piezoresistive soil stress sensor. Background technique [0002] The so-called soil stress refers to soil (including soil, sand, concrete, mountains, dam foundations of dams, bridge foundations, road foundations, building foundations, etc.) Water storage, vehicles on the road, etc.), the stress generated inside it. With the development of science and technology, especially the development of the construction industry, people have great interest in the bearing capacity of soil and the interaction between soil and structures. This raises the question of how to measure soil stress accurately. [0003] Foreign countries began to study the measurement of soil stress as early as 1913, and later developed to the transportation, waterways, construction, bridges, engineering, universities and other departments of major countries have established related research institutions. Domestic ...

AI Technical Summary

Problems solved by technology

[0004] The silicon piezoresistive pressure sensor was born in the 1950s, and it began to be practical with the maturity of integrated circuit technology. With the development of its design technology, information processing technology and micromachining technology, its application field has been continuously expanded. However, piezoresistive pressure sensors have not been applied to soil stress measurement

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