Method and device for forming enchanced thermal interface

Abstract

A method and associated apparatus for providing an enhanced thermal interface. The interface is formed by application of a structure or foil embedded in an alloy in solid form between two surfaces. Once heat is applied from one or both surfaces, the alloy melts forming the desired interface.

Description

technical field [0001] The present invention relates generally to a method and apparatus for providing an enhanced thermal interface; and more particularly to a method and apparatus for providing an enhanced thermal interface for use in semiconductor packages for computing environments. Background technique [0002] The development of the semiconductor industry has given rise to an industry trend of increasing the number of electronic components inside electronic devices. Density allows the selective fabrication of smaller and lighter devices that are more attractive to consumers. In addition, compactness also allows many circuits to operate at higher frequencies and higher speeds due to the shorter electrical distances in these devices. Despite the many advantages associated with this industrial goal, providing many of these components in a small footprint poses many challenges to device performance. One such challenge is that the thermal interface must be established wit...

AI Technical Summary

Problems solved by technology

Problems arise due to the fact that when the refractory alloy is melted, while pressing it between two surfaces, due to poor wetting between the refractory alloy and the chip and between the refractory alloy and the heat sink The resulting capillary action, the molten alloy is extruded out of the interface

In the absence of molten alloy to bridge the gap, the thermal performance of the cooling assembly is reduced

Molten alloy squeezed out of the interface can also seep and leak into other areas, especially adjacent areas housing electrical components, and can cause system degradation and failure

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