Unlock instant, AI-driven research and patent intelligence for your innovation.

Memory device, memory system, and memory control method

a memory device and control method technology, applied in the field of memory devices, memory systems, memory control methods, can solve the problems of increasing the floor area of the decoder circuit, and achieve the effects of restrainting the influence of inter-wiring capacitive coupling, and reducing the floor area

Inactive Publication Date: 2019-05-28
SONY SEMICON SOLUTIONS CORP
View PDF10 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This approach effectively reduces voltage variations in non-selected memory cells due to capacitive coupling, allowing for increased memory capacity without expanding the decoder circuit's floor area, thereby enhancing the memory device's performance and efficiency.

Problems solved by technology

This causes a disadvantage of an increase in floor area of the decoder circuit.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Memory device, memory system, and memory control method
  • Memory device, memory system, and memory control method
  • Memory device, memory system, and memory control method

Examples

Experimental program
Comparison scheme
Effect test

embodiment

1. EMBODIMENT

[Configuration]

[0055]FIG. 1 illustrates one example of functional blocks of an information processing system according to one embodiment of the disclosure. The information processing system includes a host computer 100 and a memory system 200. The memory system 200 includes a memory controller 300, one or more memory cell array units 400, and a power supply circuit 500. It is to be noted that FIG. 1 illustrates a state in which a plurality of the memory cell array units 400 are provided. The memory system 200 corresponds to one specific example of a “memory system” in the disclosure. The memory controller 300 corresponds to one specific example of a “memory controller” in the disclosure. The memory cell array unit 400 corresponds to one specific example of a “memory device” in the disclosure.

[Host Computer 100]

[0056]The host computer 100 controls the memory system 200. Specifically, the host computer 100 issues a command that specifies a logic address as a target of acc...

modification examples

2. MODIFICATION EXAMPLES

[0156]In the following, described are modification examples of the memory cell array unit 400 according to the forgoing embodiment, or the memory system 200 according to the forgoing embodiment. It is to be noted that in the following, to constituent parts common to those of the forgoing embodiment, assigned are the same reference characters as the reference characters assigned in the forgoing embodiment. Moreover, description is given mainly of constituent parts different from those of the forgoing embodiment. Description of the constituent parts common to those of the forging embodiment is omitted as appropriate.

modification example a

[0157]FIG. 20 illustrates one modification example of the functional blocks of the memory cell array unit 400 according to the forgoing embodiment. The memory cell array unit 400 according to this modification example is different in configuration from the memory cell array unit 400 according to the forgoing embodiment, in terms that the memory cell array unit 400 includes a Vcom circuit 27 instead of the pre-charge circuit 25. In the following, therefore, description is given mainly of contents related to the Vcom circuit 27, with description related to other contents being omitted as appropriate.

[0158]FIG. 21 illustrates one example of a circuit configuration of the Vcom circuit 27. The Vcom circuit 27 has a function equivalent to the function of the pre-charge circuit 25 in a state in which Low is constantly applied to the terminals Vg1 and Vg2 in the pre-charge circuit 25. The Vcom circuit 27 outputs, in accordance with the control by the memory controller 300, the single kind o...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A memory device of one embodiment of the technology includes: a plurality of memory cells in a matrix arrangement; a plurality of row wirings each coupled to one end of each memory cell; a plurality of column wirings each coupled to another end of each memory cell, a first decoder circuit coupled to each of the row wirings of even-numbered rows; a second decoder circuit coupled to each of the row wirings of odd-numbered rows; a third decoder circuit coupled to each of the column wirings of even-numbered columns; and a fourth decoder circuit coupled to each of the column wirings of odd-numbered columns. The first decoder circuit, the second decoder circuit, the third decoder circuit, and the fourth decoder circuit are constituted by independent circuits from one another.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]This application is a national stage application under 35 U.S.C. 371 and claims the benefit of PCT Application No. PCT / JP2016 / 060174 having an international filing date of 29 Mar. 2016, which designated the United States, which PCT application claimed the benefit of Japanese Patent Application No. 2015-090176 filed 27 Apr. 2015, the disclosures of which are incorporated herein by reference in their entirety.TECHNICAL FIELD[0002]The disclosure relates to a memory device including a decoder circuit, a memory system including the memory device, and a memory control method in the memory device as mentioned above.BACKGROUND ART[0003]In recent years, there has been a desire for enlargement of capacity of non-volatile memories for data storage typified by resistance variable memories such as ReRAM (Resistive Random Accessible Memory). However, currently-existing resistance variable memories that utilize access transistors cause an increase in fl...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(United States)
IPC IPC(8): G11C13/00G11C8/10
CPCG11C13/0038G11C8/10G11C13/00G11C13/004G11C13/0023G11C13/0028G11C13/0033G11C13/0061G11C13/0069G11C13/0026G11C2213/71
Inventor TERADA, HARUHIKOMORI, YOTAROKITAGAWA, MAKOTO
Owner SONY SEMICON SOLUTIONS CORP