Method of inspection by guided waves
a guided wave and inspection method technology, applied in the direction of instruments, scientific instruments, measurement devices, etc., can solve the problems of not being able to meet in satisfactory manner the effectiveness and reliability requirements of such inspections, and it is difficult or even impossible to model such parts in satisfactory manner. , to achieve the effect of simple performance, fast and robus
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[0051]FIG. 1 is a diagram of an adhesively bonded assembly 100 of differing materials to which the non-destructive inspection method of the present invention is applied.
[0052]By way of example and in non-limiting manner, the adhesively bonded assembly 100 comprises a top layer constituted by a first material 102 having a first thickness e1 and a bottom layer constituted by a second material 104 having a second thickness e2; between the first and second materials 102 and 104, there extends a third material 106 that is adhesive, being configured to hold the first and second materials 102 and 104 together, and that presents a third thickness e3.
[0053]The first material 102 has a top face 108 and a bottom face 110, and the second material 104 has a top face 112 and a bottom face 114; the adhesive third material 106 has a top face 116 placed against the bottom face 110 of the first material 102, and a bottom face 118 placed against the top face 112 of the second material 104.
[0054]By way...
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