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Electronic device and its heat dissipation assembly

a technology of heat dissipation assembly and electronic device, which is applied in the direction of cooling/ventilation/heating modifications, circuit thermal arrangements, and modifications by conduction heat transfer, etc. it can solve the problems of reducing or losing water resistance, increasing the chance of internal components, and difficult heat dissipation of the central processing unit or/and graphics processing unit with the highest workload. , to achieve the effect of enhancing heat dissipation efficiency

Active Publication Date: 2021-08-10
QUANTA COMPUTER INC
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patent aims to improve the heat dissipation efficiency of an electronic device and its heat dissipation assembly. By using a specific construction, the device can effectively dissipate heat without compromising its waterproof function, reducing the risk of the heat-generating source causing a short-circuit.

Problems solved by technology

For example, the heat dissipation problem of the central processing unit (CPU) or / and graphics processing unit (GPU) with the highest workload is the most difficult.
However, after repair / replacement or reassembly of parts in a heat dissipation facility, it often results in a reduction or loss of water resistance, thereby increasing the chance of internal components causing short-circuit failures.

Method used

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  • Electronic device and its heat dissipation assembly
  • Electronic device and its heat dissipation assembly
  • Electronic device and its heat dissipation assembly

Examples

Experimental program
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Embodiment Construction

[0027]Reference will now be made in detail to the present embodiments of the disclosure, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts. According to the embodiments, it will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the disclosure without departing from the scope or spirit of the disclosure.

[0028]Reference is now made to FIG. 1 and FIG. 3A, in which FIG. 1 is a perspective view of an electronic device 10 according to one embodiment of the disclosure, FIG. 2 is an exploded view of the electronic device 10 of FIG. 1, and FIG. 3A is a sectional view of the electronic device 10 taken along a line AA of FIG. 1. As shown in FIG. 1 to FIG. 3A, in this embodiment, the electronic device 10 includes a heat dissipation assembly 100 and a heat-generating source 500. The heat dissipa...

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Abstract

A heat dissipation assembly includes a bottom plate, an outer cover, a heat guiding base, a flow-acceleration unit and two side cover sets. The bottom loads a heat-generating source. The outer cover includes a cover body and two slots. The cover body covers the bottom plate to define an accommodation space therebetween, and the slots are oppositely formed on the cover body and connected to the accommodation space. The heat guiding base thermally contacts the heat-generating source and the cover body, and is formed with voids arranged alongside, each of the voids is communication with the slots respectively. The side cover sets are disposed within the slots, respectively, and detachably connected to the cover body and the heat guiding base. The flow-acceleration unit is disposed in one of the side cover sets to lead a fluid to the other through the voids.

Description

RELATED APPLICATIONS[0001]This application claims priority to Taiwan Application Serial Number 108147249, filed Dec. 23, 2019, which is herein incorporated by reference.BACKGROUNDField of Disclosure[0002]The disclosure relates to a heat dissipation assembly. More particularly, the disclosure relates to a heat dissipation assembly using a tunnel-type heat dissipation module.Description of Related Art[0003]Many internal components of a computer will generate a large amount of thermal energy during operation, so reliable heat dissipation services are critical factor to determine the performance and reliability of the computer. For example, the heat dissipation problem of the central processing unit (CPU) or / and graphics processing unit (GPU) with the highest workload is the most difficult. In addition, the above-mentioned internal component heat dissipation services also attach great importance to waterproof measures to reduce the chance of short-circuit failure caused by the internal ...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H05K7/20H05K1/02
CPCH05K7/20163H05K1/0203H05K7/2039H05K7/20263H05K7/20172H05K7/20145
Inventor LIN, CHING-TATSAO, LU-LUNGHUNG, CHENG-CHANGTSAI, YU-CHING
Owner QUANTA COMPUTER INC
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