Apparatus and methods for coverlay removal and adhesive application

Abstract

Apparatus and methods for synchronously removing coverlay film from an adhesive film and applying an adhesive strip cut from the adhesive film to cover one or more reject die sites and / or functional die sites on semiconductor package support elements are disclosed. Reject die sites on defective substrates are covered prior to encapsulation.

Description

FIELD OF THE INVENTION [0001] This invention relates generally to apparatus and methods for semiconductor package fabrication and more specifically to apparatus and methods for synchronous coverlay film removal and adhesive application to semiconductor support elements and the like. BACKGROUND AND SUMMARY OF THE INVENTION [0002] In semiconductor manufacture, a single semiconductor die (or chip) can be packaged within a sealed package. The package protects the die from damage and from contaminants in the surrounding environment. In addition, the package provides a substantial lead system for electrically connecting the integrated circuits on the die to the outside world. [0003] One type of semiconductor package 10 is illustrated in FIG. 1A. The package 10 includes a substrate 12 having a planar die attach surface or die site 22. A semiconductor die 16 is mounted to an upper surface of the substrate 12 on the die site 22. The die 16 is typically adhesively bonded to the substrate 12 w...

AI Technical Summary

Benefits of technology

[0002] In semiconductor manufacture, a single semiconductor die (or chip) can be packaged within a sealed package. The package protects the die from damage and from contaminants in the surrounding environment. In addition, the package provides a substantial lead system for electrically connecting the integrated circuits on the die to the outside world.

Problems solved by technology

Currently available support elements typically include one or more substrates that are defective or non-functional, i.e., the substrates include “reject die sites.” Individual substrates of a support element may be non-functional for a variety of reasons, such as faulty electrical circuitry of a substrate.

Such defect substrates of the support element cannot be utilized to fabricate a functional semiconductor package but cannot be separated from the support element prior to processing of the other substrates on the support element.

If the defective substrates are separated from the support element, such action necessarily limits the number of substrates that may be processed at one time using the separated support element.

When functional dice are attached to the “reject die sites” of the support element and further are processed, the resulting semiconductor packages are necessarily defective.

This sacrifices functional dice, thereby increasing semiconductor package manufacturing costs and decreasing yields.

Regrettably, omitting attachment of a die to a die site on a support element causes problems during the encapsulation process.

This is known as “bleeding or flashing.” The bleeding of encapsulation material produces even more defective semiconductor packages, further increasing manufacturing costs and lowering yield.

Moreover, bleeding of the encapsulation material may stick to the mold body and contaminate the next support element processed through the encapsulation machine.

This also increases semiconductor package manufacturing costs.

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