Bidimensional detector of ionizing radiation and manufacturing process for this detector

Abstract

Bidimensional detector of ionizing radiation and manufacturing process for the detector. The detector includes a block created from a material which releases secondary particles by interaction with incident ionizing radiation with an energy level greater than or equal to 100 keV. The thickness of the block is at least equal to one-tenth of the mean free path traveled by the incident ionizing radiation particles in the material. Parallel slits run through the block and the slits are filled with a fluid configured to interact with the secondary particles to produce other particles representing the radiation. The block, and then the slits, are formed, for example, by waterjet cutting, electrical discharge machining, or roll-out stretch wire. The bidimensional detector can be used, for example, for radiographic purposes.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application is a continuation of co-pending U.S. patent application Ser. No. 09 / 914,255, filed Aug. 24, 2001, which is a National Stage Application of PCT Application No. PCT / FR00 / 00448, filed Feb. 23, 2000, the entire contents of each of which are incorporated herein by reference.BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention concerns a bidimensional detector of ionizing radiation as well as a manufacturing process for this detector. [0004] The ionizing radiations which can be detected by the invention can particularly consist of X-rays, gamma photons, protons, neutrons or muons. [0005] The detector, subject of the current invention, is capable of converting incident ionizing radiation into particles, which are themselves ionizing (electrons for example) and are easier to work with than the incident ionizing radiation. [0006] In particular, the invention may be used in the following secto...

AI Technical Summary

Benefits of technology

[0028] The objective of the present invention is a detector that remedies the aforementioned inconveniences of hole-based detector (that is, expensive and low performance levels). The present invention proposes to meet this objective, in part, by using slits instead of holes.

[0031] The detector is far less expensive to manufacture than the hole-system detectors previously mentioned.

[0033] The detector is also easy to manufacture, and offers a very important useful detection surface.

Problems solved by technology

This frontal shock chips the material in which the holes are to be cut, which splits the material and makes it unfit for use.

However chemical etching is an expensive and slow process.

Moreover, the quantity of secondary electrons collected, and by extension, the performance levels of hole-system detectors are limited since only between 10% to 30% of the secondary electrons created in the course of each gas ionization are collected.

This can be explained by the fact that chemical etching does not create holes whose interior walls are perfectly cylindrical, that is, it cuts bottlenecks in the holes which in turn causes the electric field line to be deformed and reduces the useful diameter of the holes.

Thus, the performance levels of hole-system detectors are low.

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