Switching circuitry for reconfigurable arrays of sensor elements

a sensor element and reconfigurable technology, applied in the field of reconfigurable arrays of sensors, can solve the problems of difficult to produce electronics that would allow individual control of such small cells, and it is not possible to create larger cells that still perform well,

Active Publication Date: 2005-08-04
GENERAL ELECTRIC CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It may not be possible to create larger cells that still perform well in terms of frequency response and sensitivity desired.
Unfortunately, it is difficult to produce electronics that would allow individual control over such small cells.
While in terms of the acoustical performance of the array as a whole, the small cell size is excellent and leads to great flexibility, control is limited to larger structures.
However, subelements comprise connected cells that are not switchably disconnectable and thus cannot be reconfigured.
Reconfigurable ultrasound arrays require a complex switching network that may be difficult or impossible to implement with currently available electronics.

Method used

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  • Switching circuitry for reconfigurable arrays of sensor elements
  • Switching circuitry for reconfigurable arrays of sensor elements
  • Switching circuitry for reconfigurable arrays of sensor elements

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Embodiment Construction

[0040] The invention is directed to a device comprising an array of sensors that are reconfigurable by means of a switching network. For the purposes of illustration, the reconfigurable array will be described with reference to capacitive micromachined ultrasonic transducers (cMUTs). However, it should be understood that the aspects of the invention disclosed herein are not limited in their application to probes employing cMUTs, but rather may also be applied to probes that employ pMUTs or even diced piezoceramic arrays where each of the diced subelements are connected by interconnect means to an underlying switching layer. The same aspects of the invention also have application in reconfigurable arrays of optical, thermal or pressure sensors.

[0041] Referring to FIG. 1, a typical cMUT transducer cell 2 is shown in cross section. An array of such cMUT transducer cells is typically fabricated on a substrate 4, such as a heavily doped silicon (hence, semiconductive) wafer. For each cM...

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Abstract

A device comprising an array of sensors that are reconfigurable by means of a switching network. The sensors may be optical, thermal or pressure sensors or ultrasonic transducers. More specifically, the device comprises: a multiplicity of sensor elements; a plurality of bus lines; a set of access switches for selectively connecting a set of the sensor elements in a row to a bus line, one of the access switches being connected to a first sensor element; a multiplicity of sets of matrix switches, each of the sets of matrix switches selectively connecting a respective sensor element of the multiplicity of sensor elements to a respective set of adjacent sensor elements, one of the matrix switches being connected to the first sensor element and to a second sensor element that is not a member of the set of sensor elements; and control circuitry that controls the access switches and the matrix switches in accordance with a selected switching configuration such that the first sensor element is connected to the bus line via said one access switch, while at the same time the second sensor element is connected to said one access switch via said one matrix switch.

Description

RELATED PATENT APPLICATION [0001] This application is a continuation-in-part of and claims priority from U.S. patent application Ser. No. 10 / 383,990 filed on Mar. 6, 2003 and entitled “Mosaic Arrays Using Micromachined Ultrasound Transducers”.STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH AND DEVELOPMENT [0002] The United States Government may have certain rights in this invention pursuant to U.S. Government Contract Number DAMD17-02-1-0181 awarded by the U.S. Army.BACKGROUND OF THE INVENTION [0003] This invention generally relates to reconfigurable arrays of sensors (e.g., optical, thermal, pressure, ultrasonic). In particular, the invention relates to reconfigurable micromachined ultrasonic transducer (MUT) arrays. One specific application for MUTs is in medical diagnostic ultrasound imaging systems. Another specific example is for non-destructive evaluation (NDE) of materials, such as castings, forgings, or pipelines. [0004] Conventional ultrasound imaging systems comprise an a...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B06B1/02B06B1/06H04R17/00A61B8/00
CPCB06B1/0207B06B1/0292H03M11/00G01N2291/044G01N2291/106G01N29/262H04R17/00
Inventor THOMENIUS, KAI ERIKFISHER, RAYETTE ANNWODNICKI, ROBERT GIDEONHAZARD, CHRISTOPHER ROBERTSMITH, LOWELL SCOTTMILLS, DAVID MARTIN
Owner GENERAL ELECTRIC CO
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