Method and apparatus for cleaning mounting nozzle, and mounting machine

Abstract

A cleaning apparatus according to the invention is used for an electronic component mounting machine, includes a abrading unit for abrading the suction surface of the mounting nozzle; and a drive unit for moving the abrading unit in a predetermined direction, the abrading unit being formed by a ceramics structure, and a grain size of a contact surface of the abrading unit ranges from P1000 to P5000, the contact surface of the abrading unit coming into contact with the suction surface of the mounting nozzle.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a method and an apparatus for cleaning a mounting nozzle included in a mounting machine which mounts electronic components and the like on a substrate and the like, and the mounting machine into which the cleaning apparatus is incorporated. [0003] 2. Related Background Art [0004] Conventionally an electronic component mounting machine for placing the electronic components, such as flip chip cut from a wafer, on a circuit board and the like is used. Generally the electronic component mounting machine includes a pick-up unit and a mounting unit. The pick-up unit picks up the chip from the wafer to transport the chip to the mounting unit, and the mounting unit places the chip delivered from the pick-up unit on the circuit board and the like. [0005] In the electronic component mounting machine, by using a suction nozzle communicated with a vacuum source, the chip is picked up from the wa...

AI Technical Summary

Benefits of technology

The invention provides a cleaning apparatus for an electronic component mounting machine that can clean the suction surface of the mounting nozzle without generating peel of the abrasive grain. The abrasive member can control the surface roughness of the suction surface with high accuracy, and does not affect the surface being cleaned. The abrasive member is made of ceramics and has a grain size ranging from P1000 to P5000. The cleaning apparatus includes a mounting machine that can stably mount electronic components onto the circuit board.

Problems solved by technology

Accordingly, it is not desirable that swarf, dust, wafer paste, and the like exist on a suction surface of the suction nozzle, because there is a fear that the swarf, the dust, the wafer paste, and the like obstruct suction and hold of the chip.

When the grains are peeled off from the abrasive member, because the suction surface cannot be abraded with a predetermined grain size, there is a fear that the cleaning is not sufficiently performed.

In the state in which the peeled grains adheres to the suction surface, the mounting nozzle fails to suck the electronic component, the surface of the electronic component is damaged by the grains on the suction surface, or sometimes the electronic component is broken by the grains.

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