Method for recycling/reclaiming a monitor wafer
Patent Information
- Authority / Receiving Office
- US · United States
- Current Assignee / Owner
- TEXAS INSTR INC
- Publication Date
- 2006-01-12
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
TECHNICAL FIELD OF THE INVENTION
[0001] The present invention is directed, in general, to a method for manufacturing an integrated circuit and, more specifically, to a method for recycling / reclaiming a monitor wafer used in the manufacture of an integrated circuit. BACKGROUND OF THE INVENTION
[0002] In practical semiconductor fabrication, hundreds and hundreds of individual manufacturing steps are required to convert a bare silicon wafer into one or more operational integrated circuits (ICs). In an effort to save time and money, after each individual manufacturing step is set up a monitor or test wafer is processed through the given manufacturing step to examine whether the manufacturing step achieves its intended purpose. If the specific manufacturing step being tested achieves its intended purpose, then the manufacturer is confident that actual device wafers may be subjected to the manufacturing step. However, if the specific manufacturing step being tested does not achieve its in...