Sawing and sorting system

a sorting system and cutting machine technology, applied in the direction of thin material processing, article separation, electrical equipment, etc., can solve the problems of increased cleaning time, large consumption of cleaning solution and air, and possible generation of debris, so as to facilitate the change and/or maintenance of tools and/or parameters

Inactive Publication Date: 2006-03-16
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0018] An exemplary embodiment of the invention is directed to a sawing and sorting system, in which a combination

Problems solved by technology

During the sawing process, debris may be generated.
The conventional sawing and sorting system removes debris using a cleaning solution and air, which results in consumption of a considerable amount of cleaning soluti

Method used

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  • Sawing and sorting system
  • Sawing and sorting system
  • Sawing and sorting system

Examples

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Embodiment Construction

[0037] The invention will be described below with reference to the accompanying drawings, in which exemplary embodiments of the invention are illustrated. It will be appreciated that the invention may be embodied in many different forms and should not be construed as limited to the particular embodiments set forth herein. Rather, the disclosed embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0038] Well-known structures and processes have not been described or illustrated in detail to avoid obscuring the invention. For simplicity and clarity of illustration, some elements illustrated in the figures may not be drawn to scale. For example, the dimensions of some of the elements may be exaggerated or reduced relative to other elements for clarity.

[0039] Referring to FIGS. 3 and 4, an exemplary embodiment of a sawing and sorting system 100 combines a sawing process and a sorting...

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PUM

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Abstract

A sawing and sorting system combines a sawing apparatus and a sorting apparatus. The sawing and sorting system comprises a loader. The loader comprises a magazine receiving a plurality of strips. A mounting unit mounts the strip thereon. A plurality of transfer and sawing robots each comprises a picker unit. The picker unit comprises a rotatable chuck table. The transfer and sawing robot transfers the picker unit horizontally and vertically. The rotatable chuck table holds the strip. The picker unit rotates the rotatable chuck table. A plurality of sawing spindle units each comprises a rotary blade. The sawing spindle unit moves the blade horizontally to divide the strip into unit packages. A cleaning unit cleans the unit package. A test means inspects the unit package according to a test criteria. A sorting table mounts the unit package for sorting. An unloader provides trays. A sorting transfer robot sorts the unit packages into the trays.

Description

CROSS REFERENCE TO RELATED APPLICATIONS [0001] This U.S. non-provisional application claims priority and benefit of Korean Patent Application No. 2004-71767, filed on Sep. 8, 2004, the entire contents of which are herein incorporated by reference. BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The invention relates to an apparatus for manufacturing semiconductor chip packages and, more particularly, to a sawing and sorting system. [0004] 2. Description of the Related Art [0005] For a semiconductor chip package, for example a fine pitch ball grid array and a tape ball grid array, a substrate strip (hereinafter referred to as a strip) may be used during a die attaching process, a wire bonding process, and a molding process. The substrate strip, which may comprise a plurality of unit substrates, is divided into unit semiconductor chip packages (hereinafter referred to as unit packages). The unit packages are then tested and sorted into good or faulty packages. [000...

Claims

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Application Information

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IPC IPC(8): B65H1/00
CPCB28D5/029B28D5/0082H01L21/78
Inventor KIM, YONG-KUKKIM, HYUN-HOKIM, HO-SEONGSUN, YONG-KYUNCHOI, TAI-KEW
Owner SAMSUNG ELECTRONICS CO LTD
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