Sawing and sorting system

Abstract

A sawing and sorting system combines a sawing apparatus and a sorting apparatus. The sawing and sorting system comprises a loader. The loader comprises a magazine receiving a plurality of strips. A mounting unit mounts the strip thereon. A plurality of transfer and sawing robots each comprises a picker unit. The picker unit comprises a rotatable chuck table. The transfer and sawing robot transfers the picker unit horizontally and vertically. The rotatable chuck table holds the strip. The picker unit rotates the rotatable chuck table. A plurality of sawing spindle units each comprises a rotary blade. The sawing spindle unit moves the blade horizontally to divide the strip into unit packages. A cleaning unit cleans the unit package. A test means inspects the unit package according to a test criteria. A sorting table mounts the unit package for sorting. An unloader provides trays. A sorting transfer robot sorts the unit packages into the trays.

Description

CROSS REFERENCE TO RELATED APPLICATIONS [0001] This U.S. non-provisional application claims priority and benefit of Korean Patent Application No. 2004-71767, filed on Sep. 8, 2004, the entire contents of which are herein incorporated by reference. BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The invention relates to an apparatus for manufacturing semiconductor chip packages and, more particularly, to a sawing and sorting system. [0004] 2. Description of the Related Art [0005] For a semiconductor chip package, for example a fine pitch ball grid array and a tape ball grid array, a substrate strip (hereinafter referred to as a strip) may be used during a die attaching process, a wire bonding process, and a molding process. The substrate strip, which may comprise a plurality of unit substrates, is divided into unit semiconductor chip packages (hereinafter referred to as unit packages). The unit packages are then tested and sorted into good or faulty packages. [000...

AI Technical Summary

Benefits of technology

[0018] An exemplary embodiment of the invention is directed to a sawing and sorting system, in which a combination of a sawing apparatus and a sorting apparatus may facilitate change and / or maintenance of a tool and / or parameter.

[0019] Another exemplary embodiment of the invention is directed to a sawing and sorting system, in which the amount of a cleaning solution and / or air used in a cleaning operation may be reduced and the cleaning time may be reduced.

[0020] Another exemplary embodiment of the invention is directed to a sawing and sorting system, in which the time of operations other than sawing and sorting operations may be reduced, thereby improving productivity.

Problems solved by technology

During the sawing process, debris may be generated.

The conventional sawing and sorting system removes debris using a cleaning solution and air, which results in consumption of a considerable amount of cleaning solution and air and an increased cleaning time.

The conventional sawing and sorting system also includes first and second cleaning operations, thereby resulting in reduced productivity and an inefficient cleaning operation.

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