Chip-based CPU cooler and cooling method thereof

Abstract

Provided are chip-based CPU cooling device and cooling method thereof. The cooling device comprises a metal cover adapted to completely cover and contact the CPU, a hollow seat, a thermal electric cooler shaped to fit in the seat and adapted to contact the cover, a heat dissipation member (e.g., fins) enclosed by a housing and mounted on the seat for contacting the thermal electric cooler, a first fan mounted on top of the housing, and a second fan mounted on side of the housing. An optimum heat dissipation can be obtained by running a control program to control on / off of the fans and power of the thermal electric cooler by operating the cooling device in one of a plurality of corresponding temperature ranges of the CPU.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of Invention The present invention generally relates to CPU (central processing unit) cooling devices and more particularly to a chip-based CPU cooling device having a thermal electric cooler and a cooling method thereof. [0002] 2. Description of Related Art [0003] Operating frequency of the CPU of a computer has been continuously increasing as the technology develops. Accordingly, heat generated by a running CPU increases greatly. Heat dissipation thus has become a critical issue in maintaining the normal operation of a CPU (i.e., computer). [0004] Conventionally, a CPU cooler is implemented as a passive one. In detail, a member formed of high heat conduction metal or alloy is mounted on the CPU. The member comprises a plurality of parallel fins. In operation, heat generated by CPU is transferred to the fins by contact prior to dissipating to the ambient. For achieving maximum heat dissipation, the number of fins, locations of the fins, a...

AI Technical Summary

Benefits of technology

[0006] It is therefore an object of the present invention to provide a chip-based CPU cooling device having a metal cover completely covered and contacted the CPU for facilitating heat dissipation by eliminating external air interference.

[0007] It is another object of the present invention to provide a chip-based CPU cooling device comprising a hollow seat and a housing each having an outer wall, an inner wall, and a groove defined by the walls for directing air communication with a cover or fins by eliminating external air interference.

[0009] In one aspect of the present invention, there is provided a chip-based cooling device mountable on a CPU arranged on a motherboard, comprising a metal cover, a hollow seat, a thermal electric cooler, a heat dissipation member, a housing, a first fan, and a second fan wherein the cover is adapted to completely cover and contact the CPU, the thermal electric cooler is shaped to fit in the seat, the heat dissipation member is enclosed by the housing and is mounted on the seat, the first fan is mounted on top of the housing, the second fan is mounted on one side of the housing, the thermal electric cooler is adapted to contact the cover, and the heat dissipation member is adapted to contact the thermal electric cooler, and wherein the seat and housing each having an outer wall, an inner wall, and a groove defined by the walls for directing air communication with a cover or fin by eliminating external air interference.

Problems solved by technology

Heat dissipation thus has become a critical issue in maintaining the normal operation of a CPU (i.e., computer).

However, the desired good heat dissipation of CPU is compromised as interference among heat conduction, convection, and radiation.

However, heat may undesirably transfer back to the heat absorbing surface if cooling members arranged at the heat dissipating surface operate abnormally.

Moreover, dew may generate on the cooler due to abrupt temperature drop.

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