Integrated circuit packaging structure and method of making the same

Abstract

The invention provides an integrated circuit packaging and method of making the same. The integrated circuit packaging includes a substrate, a semiconductor die, a heat-dissipating module, and a protection layer. The substrate has an inner circuit formed on a first surface, and an outer circuit formed on a second surface and electrically connected to the inner circuit. The semiconductor die is mounted on the first surface of the substrate such that the plurality of bond pads contact the inner circuit. The heat-dissipating module includes a heat-conducting device, and the heat-conducting device, via a flat end surface thereof, contacts and bonds with a back surface of the semiconductor die. The protection layer contacts a portion of the first surface of the substrate and a portion of the heat-conducting device, such that the semiconductor die is encapsulated therebetween.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to an integrated circuit (IC) packaging structure and a method of making the same, and more particularly, the IC packaging structure according to the invention includes a heat-dissipating module. [0003] 2. Description of the Prior Art [0004] Heat dissipating has always been a prerequisite consideration for the design of electronic systems to decrease the chances of a breakdown or destruction on an electric device caused by overheating, so as to improve the reliability of the whole system. [0005] For current ICs, especially for CPU in computers, the technique for heat dissipation usually involves using a metal with high thermal conductivity as the basic heat-dissipating material and combining heat-dissipating fins and a powerful fan to fit the request of heat dissipating for the current ICs. [0006] In the current heat-dissipating techniques, most of the heat-dissipating modules are confi...

AI Technical Summary

Benefits of technology

[0016] Because the IC packing structure of the invention bonds the heat-dissipating module with the semiconductor die, the heat-conducting device directly conducts the heat produced by the semiconductor die to the surrounding air via the fins. This not only solves the hot spot issue, but also greatly improves the heat-dissipating efficiency. The IC packing structure further integrates other heat-dissipating techniques to achieve a better effect of heat dissipating. Therefore, comparing with the prior art, the IC packing structure of the invention is more suitable for the application of high power semiconductor devices.

Problems solved by technology

Because the heat produced by the chip is dissipated by means of conducting through multilayer materials, not by means of directly contacting the heat dissipating module, the heat can not be quickly dissipated, and the problem of heat concentration caused by hot spots cannot be efficiently solved.

Therefore, the heat-dissipating efficiency of a chip cannot be precisely controlled, and the performance of the IC is lowered due to overheating.

The technique for heat dissipating faces the challenge of products boasting characters of miniature, integration, high heat-dissipating capability, and high energy density.

The current technique for heat dissipation is gradually failing to fulfill the demands of heat dissipation in new products.

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