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Thermosetting resin compounds

a technology of thermosetting resin and resin compounds, which is applied in the field of insulating materials, can solve the problems of high-conductivity insulating materials, low thermal conductivity of thermosetting resins, and insufficient heat dissipation, so as to reduce the amount of filler powder to be added, reduce the viscosity of resins, and increase the workability of them

Inactive Publication Date: 2006-12-07
AKATSUKA MASAKI +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The solution significantly increases thermal conductivity while maintaining isotropic structure, allowing for reduced filler usage, lower viscosity, and improved workability, effectively dissipating heat in electronic components.

Problems solved by technology

To dissipate this lot of heat has been a great problem to be solved.
Generally, however, the thermal conductivity of the thermosetting resin is low and not enough to dissipate a lot of heat of highly-densed conductors.
Therefore, high-conductivity insulating materials have been much required.
However, filler powder in a thermosetting resin will increase the viscosity of the resin strikingly, make it difficult to manufacture microstructures of resin, and reduce their workability.
Further, the thermal conductivity of the thermosetting resin is extremely low and a little amount of filler powder does not improve the thermal conductivity of the resin so much.
However, it is substantially difficult to disperse such a large quantity of filler powder uniformly in the resin.
Furthermore, in most cases, the affinity of filler powders to the thermosetting resin that is one of organic compounds is not so strong.
This may easily cause interfacial separation between the filler powder and the resin and consequently reduce the insulation performance of the resin dramatically when it is used for a long time.
However, the super-highly oriented polymer fibers are not so thermal-conductive across the orientation axis.
So, if dispersed randomly in the organic insulating compounds, such polymer fibers will seldom or never improve the thermal conductivity of the compound.
However, this material has less thermal conductivity in the other directions, particularly, in the in-depth direction of the film.
Therefore, this kind of material is not effective for electric and electronic apparatus.
Indeed, these methods can prepare materials having high thermal conductivity in the in-depth direction of the film, but their molding becomes very complicated and only a limited number of such materials are available.

Method used

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Experimental program
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Effect test

embodiment 1

[0067] We prepared a 5 mm-thick high-conductive thermosetting resin plate by fusing and mixing Tw8 and DDM (at stoichiometric quantities) at 160° C. for 10 hours in advance, injecting thereof into a mold which was treated with a mold-releasing agent, and heating thereof to harden. For detailed conditions of preparation, see Table 1.

[0068] We put this resin plate between two polarization plates in the crossed Nicol field and observed Moire fringes due to the depolarization through a microscope. Therefore, we assumed that this resin plate has an anisotropic structure.

[0069] Further, we observed anisotropic structures in this resin plate (dyed by RuO4) by a TEM at a power of 30,000. The maximum diameter of the anisotropic structures is 1600 nm and the ratio of the anisotropic structure is 40% by volume. We determined boundaries of the anisotropic structures by controlling the contrast of the obtained images.

[0070]FIG. 1 shows a microscopic view of the resin plate in which anisotropi...

embodiments 2 through 6

[0073] In the method similar to Embodiment 1, we prepared various high-conductive thermosetting resin plates using monomers and hardening agents listed in Table 1 at compounding ratios and hardening temperatures listed in Table 1 for 10 hours.

[0074] We checked whether these resin plates had anisotropic structures, measured their thermal conductivities, maximum diameters of the anisotropic structures, and ratios of the anisotropic structures in the manner similar to Embodiment 1. The results of checks and measurements are also listed in Table 1.

[0075] Each of these resin plates has anisotropic structures. Maximum diameters of anisotropic structures and ratios of anisotropic structures of the resin plates are respectively 400 nm or more and 25% by volume.

[0076] The measured thermal conductivities of these resin plates are 0.68 to 1.05 W / m·K, which is very high. Among them, the resin plates (of Embodiments 1 through 3) using twin mesogen type epoxy resin monomers have greater maximu...

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Abstract

This invention provides a thermosetting resin compound containing 25% or more by volume of anisotropic structure in the resin ingredient, wherein a structure constituting said anisotropic structure has a covalent bond and the maximum diameter of the structure is 400 nm or more. The resin ingredient of said thermosetting resin compound is preferably a hardened epoxy resin compound containing a mesogen-structured epoxy resin monomer and an epoxy resin hardening agent. The epoxy resin monomer in the thermosetting resin compound is preferably an epoxy resin monomer expressed by Formula (1) below E-M-S-M-E  (1)(where E, M, and S respectively indicate an epoxy group, a mesogen group, and a spacer). Therefore, this invention can provide a highly thermal conductive hardened thermosetting resin compound whose thermal conductivity is increased highly.

Description

CROSS REFERENCE TO RELATED APPLICATION [0001] This application is a Continuation application of application Ser. No. 10 / 477,926, filed Nov. 18, 2003, the contents of which are incorporated hereby by reference in their entirety. Ser. No. 10 / 477,926 is a National Stage application, filed 35 USC 371, of International (PCT) Application No. PCT / JP01 / 04177, filed May 18, 2001.TECHNICAL FIELD [0002] This invention relates to an insulating material for electric and electronic apparatus and particularly to thermosetting resin compounds having excellent thermal conductivity. BACKGROUND OF THE INVENTION [0003] Almost all electric and electronic apparatus ranging from motors and electric generators to printed circuit boards comprise conductors to convey electricity and insulating materials. [0004] Recently, these apparatus have been downsized rapidly and required insulating materials of higher characteristics. Further, as the apparatus are downsized and their conductors are packed more densely,...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C08L63/00C08G59/22C08G59/24C09K19/38
CPCC08G59/22C08G59/245C08G59/5033C08L33/00C09K19/388C08L63/00C08L2666/04
Inventor AKATSUKA, MASAKITAKAZAWA, YOSHITAKASUGAWARA, KATSUO
Owner AKATSUKA MASAKI