Device for dental applications

Abstract

Etching compositions, curable compositions, packaged products and methods of use for the treatment of bone substrate, i.e., teeth, are described. The etch solutions generally include an inorganic acid, an organic acid and either a solvent, a surfactant or mixtures thereof. The curable composites include reactive monomers and crosslinking agents that are effective to adhere to the surface of the treated substrate. The methods of the invention provide the ability to modify a bone or bone-like surface so that the curable composition, such as an adhesive resin, can be used in combination with a restorative material.

Description

CROSS REFERENCE TO RELATED APPLICATIONS [0001] The present application is a continuation of U.S. patent application Ser. No. 10 / 323,865, filed Dec. 18, 2002, which claims benefit of U.S. Provisional Application No. 60 / 358,883, filed Feb. 21, 2002 and to U.S. Provisional Application No. 60 / 341,619, filed Dec. 18, 2001 which are hereby incorporated by reference.FIELD OF THE INVENTION [0002] The present invention relates to dental etching solutions, reactive monomeric based adhesive compositions, packaged pharmaceuticals that contain the etch solution and adhesive composition and methods for their use. More specifically, the present invention relates to a superior two step process, whereby an etch solution is applied to a tooth and subsequently causes the dentin to become receptive to adhesive compositions. After the reaction has occurred, the adhesive composition is applied to the tooth and the tooth is readied for a restorative material. BACKGROUND OF THE INVENTION [0003] The use of ...

AI Technical Summary

Benefits of technology

"The present invention provides a unique and easy-to-use bone etching solution and a curable adhesive bonding composition. The etching solution does not require rinsing and can be used with various light energy sources. The bonding composition can be used with or without the etching solution. The etching solution includes an inorganic acid, an organic acid, a surfactant, and water. The inorganic acid is present in an amount of from about 1 to about 10 parts by weight, the organic acid is present in an amount of from about 0.01 to about 20 parts by weight, the surfactant is present in an amount of from about 0.01 to about 10 parts by weight, and the water is present in an amount to equal a total of (100 parts by weight) of all components. The etching solution can be used with various functional monomers and crosslinking monomers. The curable composition includes a photoinitiator system and can be used with or without the etching solution."

Problems solved by technology

Often times, the one component application systems do not bond well to the bone substrate because the etch solution interferes with the ability of the bonding resin to adhere to the substrate.

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