Heat Exchanger With Angled Fin

Abstract

An angled finned heat exchanger and associated method is provided. The heat exchanger cools the air provided to the electronic components and is disposed at an angle with respect to direction of air flow. The heat exchanger comprises a plurality of fins that are at an angle with respect to frontal area of the heat exchanger. In alternate embodiments, the angle of the fin is optimized to minimize air pressure loss and / or drop. Some suggested methods of fabrication of the fins are also provided.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]This invention relates to cooling of electronic packages used in computing system environments and more particularly to cooling of electronic components used in large computing environments such as those including servers.[0003]2. Description of Background[0004]The industry trend has been to continuously increase the number of electronic components inside computing system environments. A computing system environment can simply comprise a single personal computer or a complex network of large computers in processing communication with one another. Increasing the components inside a simple computing system environment does create a few problems, but such an increase in complex computing system environments that include large computer complexes lead to many challenges. This is because in large and complex environments, any simple problem is magnified so that seemingly isolated issues start to affect one another, and have t...

AI Technical Summary

Benefits of technology

[0009]The shortcomings of the prior art are overcome and additional advantages are provided through the provision of an angled finned heat exchanger and incorporated method. The heat exchanger cools the air provided to the electronic components and is disposed at an angle with respect to direction of air flow. The heat exchanger comprises a plurality of fins that are at an angle with respect to frontal area of the heat exchanger. In alternate embodiments, the angle of the fin is optimized to minimize air pressure loss and / or drop. Some suggested methods of fabrication of the fins are also provided.

Problems solved by technology

Increasing the components inside a simple computing system environment does create a few problems, but such an increase in complex computing system environments that include large computer complexes lead to many challenges.

This is because in large and complex environments, any simple problem is magnified so that seemingly isolated issues start to affect one another, and have to be resolved in consideration with one another.

One such particular challenge when designing any computing system environment is the issue of heat dissipation.

Heat dissipation poses a challenge at both the module and system level.

Prior art continues to struggle to achieve an acceptable solution for the heat dissipation problem.

While that patent solved many of the heat dissipation issues related to prior art, it did not address the air pressure drop through the angled heat exchangers, a problem especially in the case of side mounted sub-frame design.

Forcing the air to enter through a heat exchanger at an oblique angle to the upstream air flow, results as illustrated in FIG. 2, in a substantial loss in air pressure.

This pressure loss adversely affects the system air flow rate impairing dissipation of heat from the system.

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