Structure of image sensor module and a method for manufacturing of wafer level package

a technology of image sensor module and manufacturing method, which is applied in the direction of electrical equipment, semiconductor devices, radio frequency control devices, etc., can solve the problems of reducing yield, reducing the yield, and reducing the yield of frame package technology, so as to facilitate the final testing of wafer level packages, reduce the cost of package structure, and increase the yield of package structure
US20080020511A1Inactive Publication Date: 2008-01-24ADVANCED CHIP ENG TECH
42 Cites 18 Cited by

Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
ADVANCED CHIP ENG TECH
Publication Date
2008-01-24
Estimated Expiration
Not applicable · inactive patent

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The present invention discloses an image sensor module and forming method of wafer level package. The image sensor module comprises a metal alloy base, a wafer level package, a lens holder, and flexible printed circuits (F.P.C.). The wafer level package having a plurality of image sensor dice and a plurality of solder balls is attached to the metal alloy base. A plurality of lens are placed in the lens holder, and the lens holder is located on the image sensor dice. The lens holder is placed in the flexible printed circuits (F.P.C.), and the flexible printed circuits (F.P.C.) has a plurality of solder joints coupled to the solder balls for conveniently transmitting signal of the image sensor dice. Moreover, the image sensor dice may be packaged with passive components or other dice with a side by side structure or a stacking structure.
Need to check novelty before this filing date? Find Prior Art

Description

CROSS-REFERENCE TO RELATED APPLICATION

[0001] This is a divisional application of the application of Ser. No. 11 / 488,653, filed on Jul. 19, 2006, now pending, of which the entire disclosure is hereby incorporated by reference.BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] This invention relates to an image sensor module, and more particularly to an image sensor module and a structure and method for manufacturing of wafer level package that can lower the cost, raise the yield and reliability.

[0004] 2. Description of the Prior Art

[0005] The semiconductor technologies are developing very fast, and especially semiconductor dice have a tendency toward miniaturization. However, the requirements for the functions of the semiconductor dice have an opposite tendency to variety. Namely, the semiconductor dice must have more I / O pads into a smaller area, so the density of the pins is raised quickly. It causes the packaging for the semiconductor dice to become more difficult and de...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More