Composite structural panel
Patent Information
- Authority / Receiving Office
- US ยท United States
- Current Assignee / Owner
- CSP SYST INC (US)
- Publication Date
- 2008-04-17
- Estimated Expiration
- Not applicable ยท inactive patent
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Abstract
Description
BACKGROUND OF THE INVENTION
[0001] The present invention generally relates to modular structural panels, and more particularly to an improved structural panel, joint, and method of fabricating the same for constructing interconnected panel systems.
[0002] Modular building components such as composite structural panels with the ability to be interconnected have been used to construct various types of residential, commercial, and industrial structures. For example, the panels may be interconnected to create walls, floors, ceilings, and partitions of a building or various types of enclosures within a building.
[0003] One type of composite panel, commonly known as structural insulated panels (SIPS), has an insulating core that is disposed between an exterior and interior facing sheets. In one method of fabricating a composite panel, a preformed rigid sheet of insulating material such as polystyrene or urethane is sandwiched between the facing sheets. In another type of fabrication used,...