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Probe card for testing image-sensing chips

a technology of image-sensing chips and probe cards, which is applied in the field of probe cards, can solve the problems of inconvenient use of circuit boards with conventional vertical type probe cards without openings, and conventional vertical type probe cards not suitable for testing image-sensing chips

Inactive Publication Date: 2008-05-29
VISERA TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0008]To achieve this object of the present invention, the probe card comprises a circuit board having a first surface, a second surface and an opening cut through the first surface and the second surface, a guide member mounted on the second surface of the circuit board, and a plurality of probes. The guide member has a plurality of through holes. The probes are made of an electrically conductive material, each having a first end respectively electr

Problems solved by technology

Due to structural limitation, a cantilever type probe card is not suitable for testing semiconductor chips having a high pin count or performing a high frequency test procedure.
However, the circuit board of a conventional vertical type probe card does not have an opening for the passing of test light.
Therefore, conventional vertical type probe cards are not suitable for use in testing image-sensing chips.

Method used

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  • Probe card for testing image-sensing chips
  • Probe card for testing image-sensing chips

Examples

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Embodiment Construction

[0012]Referring to FIGS. 1 and 2, a probe card 10 is shown for use in testing image-sensing chips, comprising a circuit board 20, a guide member 30, and probes 40. The circuit board 20 has a first surface 21, a second surface 22 opposite to the first surface 21, and an opening 23 cut through the first surface 21 and the second surface 22. The second surface 22 has electric connection members 24 arranged adjacent to the opening 23 at locations corresponding to the contacts 52 of a CMOS image-sensing chip 50 to be tested. A reinforcing ring 25 is provided at the first surface 21 in a coaxial manner relative to the opening 23 to reinforce the structural strength of the circuit board 20.

[0013]The guide member 30 has a top frame 31 and a bottom frame 33. The top frame 31 and the bottom frame 33 are arranged in a stack, each having a plurality of vertical through holes 34. The top frame 31 is mounted on the second surface 22 of the circuit board 20 corresponding to the opening 23,

[0014]Th...

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PUM

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Abstract

A probe card for testing an image-sensing chip includes a circuit board having a first surface, a second surface, and an opening cut through the first and second surfaces for the passing of a test light, a guide member, and probes. The guide member is mounted on the second surface of the circuit board and provided with through holes. The probes each have a first end respectively electrically connected to the circuit board adjacent to the opening and a second end respectively inserted through the through holes of the guide member to the outside of the guide member for electrically connecting contacts of an image-sensing chip to be tested.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to probe cards and more particularly, to a probe card for use in testing image-sensing chips.[0003]2. Description of the Related Art[0004]A probe card for use in testing a semiconductor chip is set between the test machine and the chip with the probes of the probe card respectively pressed on the respective contact pads at the test chip. During test, test signal is transmitted between the test machine and the test chip through the probe card. By means of a signal processing and computing procedure run through a test program installed in the test machine, the functioning of the test chip is examined.[0005]Regular probe cards include two types, namely, the cantilever type and the vertical type. A cantilever type probe card, such as the disclosure of U.S. Pat. No. 5,055,778, comprises a circuit board and a plurality of probes. In addition, the circuit board of a specific cantilever type probe ...

Claims

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Application Information

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IPC IPC(8): G01R1/073
CPCG01R31/311G01R1/07342
Inventor LU, SHENG-FENG
Owner VISERA TECH CO LTD