Printhead integrated circuit with ink supply channel feeding a plurality of nozzle rows

a printing head and integrated circuit technology, applied in the field of printing heads, can solve the problems of reducing limiting the size of the nozzle array, and reducing so as to reduce the volume of the ink chamber and limit the printing speed, the effect of fast refilling tim

Inactive Publication Date: 2008-12-18
SILVERBROOK RES PTY LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0022]Feeding ink to the rows of droplet ejectors via a parallel supply channel that has a supply conduit to the ‘back’ of the IC, reduces the number of deep anisotropic back etches. Less back etching preserves the structural integrity of the printhead IC which is more robust and less likely to be damaged by die handling equipment.
[0057]Increasing the speed of the media substrate relative to the printhead, whether the printhead is a scanning or pagewidth type, reduces the time needed to complete printjobs.

Problems solved by technology

Accurate registration between the thermal actuators and the nozzles can be problematic.
These problems effectively restrict the size of the nozzle array in any one monolithic plate and corresponding actuator substrate.
Furthermore, differential thermal expansion between the nozzle plate and the actuator substrate create greater misalignments as the array sizes increase.
Given these limits on nozzle array size, pagewidth printheads using this two-part design are impractical.
The complexity of this arrangement makes such printers commercially unrealistic.
Each technology may have its own advantages and disadvantages in the areas of cost, speed, quality, reliability, power usage, simplicity of construction operation, durability and consumables.

Method used

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  • Printhead integrated circuit with ink supply channel feeding a plurality of nozzle rows
  • Printhead integrated circuit with ink supply channel feeding a plurality of nozzle rows
  • Printhead integrated circuit with ink supply channel feeding a plurality of nozzle rows

Examples

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Embodiment Construction

IJ26

[0077]The embodiment shown in FIGS. 1 to 15 is referred to by the Applicant and within the Assignee company, as the IJ26 printhead. In this printhead, shape memory materials are utilized to construct an actuator suitable for injecting ink from the nozzle of an ink chamber.

[0078]FIG. 1 illustrates an exploded perspective view 10 of a single ink jet nozzle as constructed in accordance with the preferred embodiment. The ink jet nozzle 10 is constructed from a silicon wafer base utilizing back etching of the wafer to a boron doped epitaxial layer. Hence, the ink jet nozzle 10 comprises a lower layer 11 which is constructed from boron doped silicon. The boron doped silicon layer is also utilized a crystallographic etch stop layer. The next layer comprises the silicon layer 12 that includes a crystallographic pit 13 having side walls etched at the usual angle of 54.74 degrees. The layer 12 also includes the various required circuitry and transistors for example, CMOS layer (not shown)...

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Abstract

An inkjet printhead that has an array of droplet ejectors supported on a printhead integrated circuit (IC). Each of the droplet ejectors has a nozzle aperture and an actuator for ejecting a droplet of ink through the nozzle aperture. The array of droplet ejectors is arranged in a plurality of rows and an ink supply channel extending parallel to the plurality of rows, and an inlet conduit extending from the supply channel to an opposing surface of the printhead IC.

Description

CROSS REFERENCES TO RELATED APPLICATIONS[0001]The present application is a continuation in part of U.S. application Ser. No. 11 / 525,857 filed 25 Sep. 2006, which is in turn a continuation of U.S. application Ser. No. 11 / 064,011 filed on Feb. 24, 2005, now issued as U.S. Pat. No. 7,178,903 which is a continuation of U.S. application Ser. No. 10 / 893,380 filed on Jul. 19, 2004, now issued U.S. Pat. No. 6,938,992, which is a continuation of U.S. application Ser. No. 10 / 307,348 filed on Dec. 2, 2002, now issued as U.S. Pat. No. 6,764,166, which is a continuation of U.S. application Ser. No. 09 / 113,122 filed on Jul. 10, 1998, now issued as U.S. Pat. No. 6,557,977, the entire contents of which are herein incorporated by reference.[0002]The following Australian provisional patent applications are hereby incorporated by reference. For the purposes of location and identification, US patents / patent applications identified by their US patent / patent application serial numbers (USSN) are listed a...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B41J2/14B21D53/76B41J2/04B41J2/045B41J2/16B41J2/165B41J2/175B41J3/42B41J3/44B41J11/00B41J11/70B41J15/04G01D15/00G06F1/16G06F21/00G06K1/12G06K7/14G06K19/06G06K19/073G07F7/08G07F7/12G11B5/127G11C11/56H04N1/00H04N1/21H04N1/32H04N5/225H04N5/262H05K3/20
CPCB41J2/14B41J2/14427B41J2/16B41J2/1623B41J2/1626B41J2/1628B41J2/1629B41J2/1631B41J2/1632B41J2/1635B41J2/1637B41J2/1639B41J2/1642B41J2/1643B41J2/1645B41J2/1646B41J2/1648B41J2/16585B41J2/17513B41J2/17596B41J3/445B41J11/0005B41J11/70B41J15/04B41J2002/041B41J2002/14346B41J2002/14435B41J2002/14443B41J2202/21B42D2035/34G06F21/79G06F21/86G06F2221/2129G06K1/121G06K7/14G06K7/1417G06K19/06037G07F7/08G07F7/086G07F7/12G11C11/56H04N5/225H04N5/2628H04N23/00
Inventor SILVERBROOK, KIA
Owner SILVERBROOK RES PTY LTD
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