Cooling apparatus

Abstract

A cooling apparatus includes a base, a plurality of first heat pipes, a plurality of second heat pipes, a plurality of first heat conducting columns and a plurality of second heat conducting columns. Each of the first heat pipes and the second heat pipes respectively has a heat-absorbing terminal. The heat-absorbing terminals of the first heat pipes are disposed on the base spaced at intervals. The heat-absorbing terminals of the second heat pipes are stacked above the heat-absorbing terminals of the first heat pipes spaced at intervals. Each of the first heat conducting columns is installed between the heat-absorbing terminals of the two adjacent first heat pipes. Each of the second heat conducting columns is installed between the heat-absorbing terminals of the two adjacent second heat pipes. Thereby, the heat conducting area is increased within the base, and the cooling efficiency of the cooling apparatus is enhanced.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a cooling apparatus. In particular, this invention relates to a cooling apparatus that its heat pipes are stacked and heat conducting columns are disposed between the heat pipes so that the heat conducting area is increased.[0003]2. Description of the Related Art[0004]When electric machines or electronic devices are operating, the electronic components often generate a substantial amount of heat. The heat needs to be dissipated so that the electronic components are assured to operate normally and do not suffer damage due to an excessive operating temperature. In case of the CPU in a computer, the processing speed is very high and a lot of heat is generated, which needs to be rapidly dissipated to make the computer operate normally. Therefore, electric machines or electronic devices often have a cooling apparatus to dissipate the heat generated by the electronic components.[0005]The cooli...

AI Technical Summary

Benefits of technology

The present invention provides a cooling apparatus for electronic components that increases heat conducting area and enhances cooling efficiency. The cooling apparatus includes a base, multiple heat pipes, heat conducting columns, and heat-absorbing terminals. The heat pipes are stacked, allowing for an increased quantity of heat pipes and increased heat conducting area. The heat conducting columns are installed between the heat pipes, further increasing the heat conducting area. This allows for faster delivery of heat from the electronic components to the cooler.

Problems solved by technology

When electric machines or electronic devices are operating, the electronic components often generate a substantial amount of heat.

However, because the dimension of the base of the cooling apparatus is small, the quantity of the heat pipes that can be disposed on the base is few.

The cooling efficiency is inadequate when the operation speed of the electronic components increases.

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