Unlock instant, AI-driven research and patent intelligence for your innovation.

Light-emitting gallium nitride-based III-V group compound semiconductor device and manufacturing method thereof

a gallium nitride and compound semiconductor technology, applied in the direction of semiconductor devices, basic electric elements, electrical apparatus, etc., can solve the problems of difficult transverse current spreading in the p-type semiconductor layer, great difference between external quantum efficiency and internal quantum efficiency of led, etc., to achieve the effect of increasing the brightness and light emitting efficiency of led

Inactive Publication Date: 2009-11-05
HUANG KUO CHIN +4
View PDF12 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0005]Therefore it is a primary object of the present invention to provide a light-emitting gallium nitride-based III-V group compound semiconductor device and a manufacturing method thereof. The LED is added with a resistant and reflective layer or is etched to form a contact window so as to make current flows beside thereof to the active layer for generating light. Thus when the light sent to the conductive layer is emitted, the light is not absorbed or shielded by the first electrode. The current is effectively spread across the conductive layer. Therefore, the brightness and light emitting efficiency of the LED are increased.
[0006]It is another object of the present invention to provide a light-emitting gallium nitride-based III-V group compound semiconductor device and a manufacturing method thereof that form a resistant and reflective layer on the LED or have a contact window on the p-type semiconductor layer by etching, corresponding to the first electrode. Thus adhesion between the conductive layer and the p-type semiconductor layer is increased so that metal peel-off problem during manufacturing processes is improved.

Problems solved by technology

However, the external quantum efficiency of LED is not improved so that there is a great difference between the external quantum efficiency and the internal quantum efficiency of LED.
Because the p-type semiconductor layer has higher resistance so that transverse current spreading in the p-type semiconductor layer is not easy.
Therefore, the external quantum efficiency of the LED is dramatically reduced.
Such prior art can't meet requirements of users so that there is a need to provide a LED with high resistance and reflection for improving light emitting efficiency of LEDs.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Light-emitting gallium nitride-based III-V group compound semiconductor device and manufacturing method thereof
  • Light-emitting gallium nitride-based III-V group compound semiconductor device and manufacturing method thereof
  • Light-emitting gallium nitride-based III-V group compound semiconductor device and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019]Refer to FIG. 1A, a light-emitting gallium nitride-based III-V group compound semiconductor device 1 of the present invention includes a substrate 10, a n-type semiconductor layer 11, an active layer 13, a p-type semiconductor layer 14, a resistant and reflective layer 15, a conductive layer 16, a first electrode 17 and a second electrode 18. Refer to FIG. 1B, a manufacturing method of the light-emitting gallium nitride-based III-V group compound semiconductor device of the present invention consists of following steps:

[0020]Firstly, refer to step S10, provide a substrate 10 that is made from one of the following material: aluminum oxide (Al2O3), silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), aluminum nitride (AlN), gallium phosphide (GaP), silicon (Si), zinc oxide (ZnO), and manganese oxide (MnO), or their combinations. Then run the step S11, form the n-type semiconductor layer 11 over the substrate 10 and the semiconductor layer 11 is a n-type gallium...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A light-emitting gallium nitride-based III-V group compound semiconductor device and a manufacturing method thereof are disclosed. The light emitting device includes a substrate, a n-type semiconductor layer over the substrate, an active layer over the n-type semiconductor layer, a p-type semiconductor layer over the active layer, a conductive layer over the p-type semiconductor layer, a first electrode disposed on the conductive layer and a second electrode arranged on exposed part of the n-type semiconductor layer. A resistant reflective layer or a contact window is disposed on the p-type semiconductor layer, corresponding to the first electrode so that current passes beside the resistant reflective layer or by the contact window to the active layer for generating light. When the light is transmitted to the conductive layer for being emitted, it is not absorbed or shielded by the first electrode. Thus the current is distributed efficiently over the conductive layer. Therefore, both LED brightness and efficiency are improved. Moreover, adhesion between the conductive layer and the p-type semiconductor layer is improved so that metal peel-off problem during manufacturing processes can be improved.

Description

RELATED APPLICATIONS[0001]This application is a Divisional patent application of co-pending application Ser. No. 11 / 979,963, filed on 13 Nov. 2007. The entire disclosure of the prior application, Ser. No. 11 / 979,963, from which an oath or declaration is supplied, is considered a part of the disclosure of the accompanying Divisional application and is hereby incorporated by reference.BACKGROUND OF THE INVENTION[0002]The present invention relates to a light-emitting gallium nitride-based III-V group compound semiconductor device and a manufacturing method thereof, especially to a light-emitting gallium nitride-based III-V group compound semiconductor device with high resistance as well as reflection and a manufacturing method thereof.[0003]Now scientists in various countries are dedicated to developing new LED material and improving the internal quantum efficiency of LED. However, the external quantum efficiency of LED is not improved so that there is a great difference between the ex...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(United States)
IPC IPC(8): H01L21/20H01L33/32H01L33/40H01L33/46
CPCH01L33/32H01L33/46H01L33/405H01L33/40
Inventor HUANG, KUO-CHINPAN, SHYI-MINGHUANG, CHENG-KUOCHUANG, CHI-YANGCHIEN, FEN-REN
Owner HUANG KUO CHIN