Probe and probe card for integrated circuit devices using the same

Abstract

A vertical probe comprises a linear body, a tip portion connected to one side of the linear body, and at least one slot positioned on the linear body. In particular, the vertical probe includes a depressed structure having a plurality of slots positioned on the linear body in parallel and on one side of the linear body. The present application also provides a probe card for integrated circuit devices comprising an upper guiding plate having a plurality of fastening holes, a bottom guiding plate having a plurality of guiding holes and a plurality of vertical probes positioned in the guiding holes. The vertical probe includes a linear body positioned in the guiding holes, a tip portion connected to one side of the linear body and at least one slot positioned on the linear body.

Description

BACKGROUND OF THE INVENTION[0001](A) Field of the Invention[0002]The present invention relates to a vertical probe and a probe card for integrated circuit devices using the same, and more particularly, to a vertical probe having a depressed structure providing vertical displacement for relieving the stress generated as the vertical probe contacts the device under test and a probe card for integrated circuit devices using the same.[0003](B) Description of the Related Art[0004]Generally, it is necessary to test the electrical characteristics of integrated circuit devices on the wafer level to check whether the integrated circuit device satisfies the product specification. Integrated circuit devices with electrical characteristic satisfying the specification will be selected for the subsequent packaging process, and the other devices will be discarded to avoid additional packaging cost. Another electrical property test will be performed on the integrated circuit device after the packag...

AI Technical Summary

Benefits of technology

[0012]One aspect of the present invention provides a vertical probe and a probe card for integrated circuit devices using the same, the vertical probe having a depressed structure configured to provide vertical displacement to relieve the stress generated as the probe contacts the device under test.

[0015]The conventional cantilever probe cannot be applied to integrated circuit devices with high-density pads since it requires a lateral space to receive the lateral cantilever. In contrast, the vertical probe of the present application does not need the lateral space, can provide variable contact force and can be applied to the integrated circuit devices with high-density pads of very small pitch. In addition, the conventional vertical probe uses the deformation of the probe body itself to provide the vertical displacement for relieving the stress generated as the probe contacts the device under test, but the adjacent probes may contact each other and cause short circuits or collisions if the deformation of the probe body is too large or there is minor misplacement of the probe body. In contrast, the vertical probe of the present application uses the slots to relieve the stress and the slots of the vertical probes can bend to the same side to prevent the vertical probes from contacting each other and causing short circuits or collisions.

Problems solved by technology

The conventional cantilever probe cannot be applied to integrated circuit devices with high-density pads since it requires a lateral space to receive the lateral cantilever.

In addition, the conventional vertical probe uses the deformation of the probe body itself to provide the vertical displacement for relieving the stress generated as the probe contacts the device under test, but the adjacent probes may contact each other and cause short circuits or collisions if the deformation of the probe body is too large or there is minor misplacement of the probe body.

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