32results about How to "Shorting of contact" patented technology

The invention is a keypad for securely entering personal identification numbers onto automated teller machines (ATM) or similar devices. A frame secures a flexible keypad to a printed circuit board. The front of the circuit includes a set of tamper detection contacts whose electrical circuit is completed by conductive material on the keypad surface. A moat of conductive material surrounds the tamper detection contact. Opening the circuit by removing the keypad or shorting the circuit to the moat initiates a tamper response.

Attached to the reverse side of the printed circuit board are security sensitive electrical components. These security sensitive components include a static random access memory storing cryptographic information and a crypto processor. A plastic cover imprinted with a tamper detection grid forming multiple electrical circuits coupled to a tamper detection circuit covers these components. A border of conductive material on the printed circuit board also surrounds these components. Opening or shorting any of the circuits in the grid initiates a tamper response, and shorting any of the components to the border also initiates a tamper response.

A stackable connector interface with magnetic retention for electronic devices and accessories can allow power and data to be transferred between one or more stacked connectors. Each interconnected stackable connector may include one or more magnetic elements, which magnetic elements may have poles arranged to facilitate mating with other stackable connectors. The magnetic elements may also provide a magnetic retention force that holds mated connectors in contact with each other. The connectors can also include connection detection circuitry for determining whether the connectors are mated with other connectors, thereby allowing the connectors to prevent live contacts from being exposed at an unmated surface of the connectors. In addition to connection detection circuitry, routing circuitry may also be included to determine how signals should be transferred between the interconnected stackable connectors and/or corresponding devices.

A relay is designed to be used in a circuit where the voltage levels are high in comparison to the spacing between the contacts when open. Contact closure arcing is suppressed by actuating a MOSFET that shorts the contacts together while they open. The same MOSFET can momentarily short the contacts together just before they first begin to close, allowing a test current to be passed through the MOSFET and through the terminals connecting to both relay contacts, to insure that arc suppression will be successful; and if this test fails, then the relay can be disabled by a switch in series with the relay coil to prevent arcing and a possible fire hazard. Relay deactuation can be sensed to trigger arc suppression, and relay actuation can be sensed to initiate fail-safe testing by a circuit that responds no matter which way the relay coil is connected into the external circuit that drives it.

An electrical connector includes an insulating body, an inner flexible plug, two metal housings and a flexible cable. The insulating body includes a base, two side portions set on two opposite sides of said base respectively and a top board connected between the side portions. A plurality of terminal grooves is defined in the base. The inner flexible plug is combined in the insulating body. The metal housings cover the insulating body. The flexible cable is set between the insulating body and the inner flexible plug. The inner flexible plug defines a plurality of receiving slots corresponding to the terminal grooves. The receiving slots extend from top side of the inner flexible plug to its bottom side in a bent way thus the flexible cable can be electrically connected with electrical connecting terminals set in the terminal grooves. Therefore, the electrical connector is easily assembled and has a stable structure.

An ink-jet head has a flexible printed circuit and a head main body, and further has a reinforcement that is located between drive-signal terminals arranged adjacent to one another and a constant-potential-signal terminal. The drive-signal terminals and the constant-potential-signal terminal are formed on a terminal-formed face of an energy applier included in the head main body. The flexible printed circuit has an electrode-formed face on which a constant-potential-signal electrode to be bonded to the constant-potential-signal terminal with a metal bond and drive-signal electrodes to be bonded to the drive-signal terminals with a metal bond. The reinforcement is in contact with and interposed between the terminal-formed face and the electrode-formed face so that the terminal-formed face and the electrode-formed face are spaced apart from each other.

A semiconductor device is provided. The semiconductor device includes a memory device, and the memory device includes a substrate, two stacked gates, two spacers, an insulating layer, and a dielectric layer. The stacked gates having a gap therebetween are located on the substrate. The spacers having a pipe or a seam therebetween are respectively located at sidewalls of each of the stacked gates in the gap. The pipe or the seam is filled with the insulating layer. The dielectric layer is located on the substrate and covers the insulating layer and the stacked gates.

Disclosed is a battery assembly with a PCB substrate, comprising a bus bar stepped and end processed for enhanced assembly performance and electrical bonding reliability, and a PCB substrate having an assembling groove with an end of the bus bar and an insulating film for an improved stability.

A wire-bonding method and a semiconductor package using the same are provided. The semiconductor package includes a carrier; a chip mounted on the carrier; a plurality of first wires and second wires alternatively arranged in a stagger manner, with a wire loop of each second wire being downwardly bent to form a deformed portion so as to provide a height different between the wire loops of each first wire and each second wire, wherein the first and second wires electrically connect the chip to the carrier; and an encapsulant for encapsulating the chip, the first wires, the second wires and a portion of the carrier. The height difference between the wire loops of each first wire and each second wire increases a pitch between adjacent first and second wires thereby preventing the wires from contact and short circuit with each other due to wire sweep during an encapsulation process.

A waterproof fairy light has a housing, a socket and a lighting assembly. The housing has an assembling hole defined therein. The socket is mounted in the assembling hole and has a cavity defined through the socket and having an inner surface and a partition formed in the cavity on the inner surface, dividing the cavity into two spaces and having two opposite side edges formed integrally on the inner surface of the cavity so that no gap is formed between each side edge and the inner surface. The lighting assembly is mounted in the cavity of the socket and has a lighting element and two contacting pins. The integrally formed partition prevents rain from contacting both the contacting pins and causing short circuit.

The invention relates to a pharmaceutical combination comprising a mixture of (a) at least one taxane derivative and (b) at least one ω-3 poly-unsaturated acid or a derivative thereof wherein the molar ratio of (b) to (a) is not higher than 2. The invention further relates to a liquid pharmaceutical composition comprising (a) an effective amount of at least one taxane derivative, (b) an effective amount of at least one ω-3 poly-unsaturated fatty acid or a derivative thereof and (c) at least one pharmaceutically acceptable carrier and a process for the preparation of the same. The composition can be used for the therapy of cancers which are sensitive to taxane derivatives. The invention also relates to a kit comprising the individual components of the above mentioned composition placed in separate containers.

The present invention relates to an electro-rheological fluid comprising particles of at least one inorganic or organic material suspended in a polar liquid crystalline medium, the use of such electro-rheological fluid in an haptic device, an haptic device itself, a method of the production of such haptic device and the use of such haptic device in electro-optical devices.

A tuning fork type piezoelectric vibrating piece, comprising: a base unit having a base electrode for an external connection; a fork shaped arm unit extending from the base unit; a groove portion at least on a surface or a rear surface of the arm unit; a groove electrode on the groove portion; a side surface electrode on the arm unit without the groove portion; a first electrode connecting the base unit and the side surface electrode or the groove electrode; a second electrode connecting the groove electrode and the side surface electrode; and a side surface electrode set at a predetermined distance from the bottom of the fork part of the base unit. The piezoelectric vibrating piece may be packaged with a base electrode connected to an external output terminal. The piezoelectric oscillator may have an amplifier circuit and a feedback circuit with a resonant element determining the resonant frequency.

A method for insulating an aluminum backboard of a photovoltaic module comprises the following steps: shearing the aluminum backboard such that the dimensions of the aluminum backboard are 4-5 mm smaller those of the glass; forming a square aperture at the position of the electrode lead of the aluminum backboard; insulating the square aperture by cushioning a small insulating material or wrapping the edges with an insulation film when arraying and laying the modules; laminating and trimming the superimposed module components; wrapping the trimmed laminated piece around the edge with the 0.5-1 mm insulation tape; finally, framing up the laminated piece by using a frame filled with silica gel, and installing the terminal box. The invention is convenient to operate and low in investment and has a wide application prospect.

An interconnect process is provided. A substrate is provided. A plurality of gate structures is disposed on the substrate, and doped regions are disposed in the substrate and respectively located between two adjacent gate structure. A liner is conformally formed above the substrate. A dielectric layer is formed above the substrate. A contact opening is formed in the dielectric layer between two neighboring gate structures to expose the liner on the doped region and on a portion of the top surface and a portion of the sidewall of each of the gate structures. A polymer material is deposited on the liner on the portion of the top surface of each of the gate structures and on the doped region. The liner on the doped regions is removed. A conductive layer is filled in the contact opening, which is free of electrical connection to the gate structures.