Method of manufacturing printed circuit board

a printed circuit board and manufacturing method technology, applied in the direction of metallic material coating process, synthetic resin layered products, pretreated surfaces, etc., can solve the problems of difficult realization of fine circuits with less than 50 m pitch (l/s=25/25 m), difficult to generate heat, etc., and achieve high-reliability fine circuits
US20100021649A1Inactive Publication Date: 2010-01-28SAMSUNG ELECTRO MECHANICS CO LTD
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
SAMSUNG ELECTRO MECHANICS CO LTD
Publication Date
2010-01-28
Estimated Expiration
Not applicable · inactive patent

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Abstract

A method of manufacturing the same, in which a fluorine resin coating layer is formed on a resin substrate, and then a copper layer is formed using a dry process including ion beam surface treatment and vacuum deposition instead of a conventional wet process including surface roughening and electroless copper plating. The interfacial adhesion of the substrate material may be increased without changing the surface roughness thereof, thus realizing a highly reliable fine circuit. As well, a low dielectric constant and a low loss coefficient may be obtained thanks to the formation of the fluorine resin layer. Further, a wet process is replaced with a dry process, whereby the copper plating layer may be formed in an environmentally friendly manner.
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Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application is a U.S. divisional application filed under 35 USC 1.53(b) claiming priority benefit of U.S. Ser. No. 11 / 585,276 filed in the United States on Oct. 24, 2006, which claims earlier priority benefit to Korean Patent Application No. 10-2005-0125249 filed with the Korean Intellectual Property Office on Dec. 19, 2005, and Korean Patent Application No. 10-2006-0063370 filed with the Korean Intellectual Property Office on Jul. 6, 2006, the disclosures of which are incorporated herein by reference.BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] The present invention relates to a printed circuit board (PCB) and a method of manufacturing the same. More particularly, the present invention relates to a PCB, in which a hydrophilic fluorine resin coating layer is formed on a resin substrate and a dry plating process is performed instead of a conventional wet plating process, thus obtaining a highly reliable fine circuit...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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