Nonvolatile semiconductor device and method of manufacturing nonvolatile semiconductor device
a nonvolatile semiconductor and nonvolatile technology, applied in the direction of semiconductor devices, electrical devices, transistors, etc., can solve the problems of inhibiting the function of the nonvolatile semiconductor device, difficult capacitive coupling between adjacent floating gates, etc., and achieve the effect of suppressing the fluctuation of the threshold voltage of the floating ga
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first embodiment
[0028]FIG. 1 is a plan view of a nonvolatile semiconductor device 10 according to a first embodiment. As shown in FIG. 1, a semiconductor substrate 11 having a main surface, assist gates 13a, 13b formed spaced apart from each other on the main surface of semiconductor substrate 11 and extending in one direction, floating gates (first floating gates) 14a-16a, 14c-16c formed on the main surface of semiconductor substrate 11, and floating gates (second floating gates) 14b-16b formed spaced apart from floating gates 14a-16a, 14c-16c are included.
[0029]Nonvolatile semiconductor device 10 also includes control gates (first control gates) 12a, 12c formed on floating gates 14a-16a, 14c-16c, and a control gate (second control gate) 12b formed on floating gates 14b-16b.
[0030]A plurality of floating gates 15a-15c are formed spaced apart from each other between assist gates 13a, 13b along an extending direction of assist gates 13a, 13b. In addition, gap portions 25a-27a, 25b-27b are formed bet...
second embodiment
[0064]A nonvolatile semiconductor device 50 according to a second embodiment will now be described using FIGS. 10-17. FIG. 10 is a cross-sectional view of nonvolatile semiconductor device 50 according to the second embodiment. As shown in FIG. 10, nonvolatile semiconductor device 50 includes insulation film 20 formed on the main surface of semiconductor substrate 11, floating gates 15a-15c formed on the main surface via insulation film 20, ONO film 22 formed on top surfaces of floating gates 15a-15c, and control gates 12a-12c respectively formed on floating gates 15a-15c via ONO film 22.
[0065]Nonvolatile semiconductor device 50 also includes an insulation film 40 formed between control gates 12a-12c and between floating gates 15a-15c. Insulation film 40 is a porous insulation film having a permittivity lower than that of a silicon oxide film. A porous film having a permittivity of about 2.6, more specifically, silsesquioxane, porous silica, an aerogel thin film, HSG-255 (an organic ...
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