Heat dissipation device

Abstract

A heat dissipation device includes a vapor chamber, a heat dissipating fins assembly, a cover and a fan. The vapor chamber is configured to a bent shape. The heat dissipating fins assembly is adhered to a partial surface of the vapor chamber. The cover is connected to the vapor camber. A flow passage is defined between the vapor chamber and the cover. The heat dissipating fins assembly is positioned in the flow passage. The cover defines an opening communicating to the flow passage. The fan is arranged facing to the opening of the cover and other partial surface of the vapor chamber. Therefore, the heat dissipating efficiency can be greatly improved.

Description

BACKGROUND[0001]The present invention relates to a heat dissipation device, and particularly to a heat dissipation device with a bent vapor chamber.[0002]With enhancement of the calculating capability of the central processing unit (CPU), the heat generates from the CPU is becoming greater than before. A conventional heat dissipation device composed of heat dissipating fins and a fan could not meet the heat dissipating requirement of the CPU. A vapor chamber with higher heat conducting efficiency is developed. The vapor chamber is combined with the heat dissipating fins to effectively resolve the heat dissipating problems. The vapor chamber could contact the heat generating electronic element in a large area directly, and these advantages could draw more development on the merit.[0003]A conventional heat dissipaton device includes a vapor chamber, a heat dissipating fins assembly and a fan. The vapor chamber is configured to a flat shape, and the vapor chamber is adhered to a surfac...

AI Technical Summary

Benefits of technology

[0005]The present invention relates to a heat dissipation device, the heat dissipation device includes a cover covering on a heat dissipating fins assembly and a fan. The airflow from the fan can be centralized to dissipate heat from the heat dissipating fins assembly and a vapor chamber directly to enhance the efficiency of the heat dissipation.

[0006]The present invention relates to a heat dissipation device, the heat dissipation device includes a bent vapor chamber to enhance a heat conducting area thereof to enhance the efficiency of the heat dissipation.

[0007]The present invention relates to a heat dissipation device, the heat dissipation device includes a bent vapor chamber on opposite sides thereof to avoid interference with the other electronic elements of the mainboard to achieve a better applicability of installation.

Problems solved by technology

A conventional heat dissipation device composed of heat dissipating fins and a fan could not meet the heat dissipating requirement of the CPU.

However, the conventional heat dissipation device has following disadvantage in practice use: when the fan dissipating heat from the heat dissipating fins assembly and the vapor chamber, the airflow can not be centralized effectively causing insufficient heat dissipation.

Thus, the heat dissipating efficiency could be affected.

Additionally, the vapor chamber is made in flat shape, however the outer surface thereof is adhered to the heat generating element completely, and further the heat conducting area is limited to the outer surface of the heat generating element.

Thus, the heat dissipating efficiency can not be further improved efficiently.

If the vapor chamber is broaden to enlarge the outer surface thereof, the other electronic elements on the circuit board may be intervened accordingly to cause the heat dissipation device not be appropriately installed and not be used therefore.

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