Heat exchanger

a technology of heat exchanger and heat exchanger plate, which is applied in the direction of soldering apparatus, manufacturing tools, light and heating equipment, etc., can solve the problems of unavoidable defects, heavy weight, and aluminum brazing is apt to be more complicated

Inactive Publication Date: 2010-09-09
HITACHI CABLE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, owing to a progress of the aluminum brazing technique and due to a problem of lead (Pb) involved in solder, the latter heat exchanger made of aluminum is used in most cases in recent years.
However, when aluminum can not be used due to inconveniences such as corrosion in the tube member, the former heat exchanger made of brass is used even now.
However, in a case of the heat exchanger made of brass, there is an unavoidable defect such as a heavy weight, compared with the latter heat exchanger made of aluminum.
Generally, the aluminum brazing is apt to be more complicated in its process, thus incurring higher cost than soldering.
However, a conventional technique involves a problem that it is extremely difficult to surely join the fin member and the tube member made of aluminum by soldering.
Further, in order to overcome both of a susceptibility to a corrosion, which is a defect when the heat exchanger is made of all aluminum, and a defect that total weight is increased, which is a defect when the heat exchanger is made of all brass, it is effective to use a method of making a the tube member using a copper-based material such as brass, and also making the fin member using aluminum.
We study on this method, but in this case, there is a problem that it is extremely difficult to surely join a member made of aluminum and a member made of copper-based metal such as brass by plating according to the conventional technique.
However, actually, there is a high possibility that a part near the joint part is remarkably damaged and deteriorated after soldering by use of such an extremely strong flux as described above, which is an undesirable defect from a viewpoint of durability and reliability of the joint part.

Method used

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Examples

Experimental program
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Effect test

first embodiment

The Heat Exchanger

[0036]In the heat exchanger according to the first embodiment, the fin member 1 is formed by folding and bending a fin plate material 9, an example of which is shown in FIG. 2, into a wave shape, and is disposed in a state of being interposed between adjacent two tube members 2, 2, and each part of the fin member 1 brought into contact with the tube member 2 is surely joined to the tube member 2. Further, the fin member 1 is disposed in a state of being interposed between right and left tank members 3. The fin member 1 and the tank member 3 may be joined each other or may be simply set in contact with each other mechanically.

[0037]The fin plate material 9 has a solder wetting film layer 5 containing copper (Cu), on approximately the whole surface or at least in a part of the fin substrate 6 made of aluminum (Al) or an alloy mainly composed of aluminum (Al) where the fin member 1 and the tube member 2 are joined each other.

[0038]According to a preferable numerical a...

second embodiment

The Heat Exchanger

[0060]In the heat exchanger according to the second embodiment, the fin member 1 as shown in FIG. 7 is used. Namely, the fin member 1 is formed by further adding the solder film layer 12 to the outermost surface of the fin plate material 9 of the first embodiment, and folding and bending this fin plate material 9 into a prescribed wave shape. The fin member 1 is disposed in such a manner as being sandwiched between the adjacent two tube members 2 and 2, so that each part where the tube member 2 and the fin member 1 are brought into contact with each other, is surely joined each other. Moreover, the fin member 1 is disposed in such a manner as being sandwiched between right and left tank members 3. The fin member 1 and the tank member 3 may be joined each other or may be set in a state of simply being brought into contact with each other mechanically.

[0061]Further specifically, the fin member 1 has the solder wetting film layer 5 containing copper, on approximately ...

example 1

[0079]According to the first embodiment, as example 1, the trial model of the heat exchanger having the structure as shown in FIG. 5 and FIG. 6 was manufactured and its joint state was evaluated.

[0080]First, the fin member 9 having the structure as shown in FIG. 2, the tube plate material 10 having the structure as shown in FIG. 3, and the tank member 13 having the structure as shown in FIG. 4 were manufactured.

[0081]As the fin substrate 6, being the substrate of the fin plate material 9, a hard material of A5052, being an Al—Mg alloy (Al—Mg based alloy defined in JIS, containing 2.2 to 2.8 wt % of Mg) having thickness of t=50 μm, width of W1=16 mm, and length of 40 mm, was used.

[0082]As the tube substrate 11, being the substrate of the tube plate material 10, a brass material having a composition of Cu—35 wt % Zn, and having thickness of 230 μm, width W2=20 mm, and length of 80 mm, was used.

[0083]Also, as the tank substrate 14, being the substrate of the tank plate material 13, the...

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Abstract

A heat exchanger is provide, in which a fin member and a tube member are joined each other, wherein the fin member includes a solder wetting film layer containing copper, in at least a part of a surface of a fin substrate made of aluminum or an alloy mainly composed of aluminum, where the fin member and the tube member are joined each other, and the tube member includes a solder film layer made of solder containing tin, in at least a part of a surface of a tube substrate made of copper or an alloy mainly composed of copper, where the tube member and the fin member are joined each other, wherein the fin member and the tube member are joined each other, through a diffusion bonding of a copper component of the solder wetting film layer and a tin component of the solder film layer.

Description

TECHNICAL FIELD [0001]The present invention relates to a heat exchanger having a structure in which a fin member and a tube member are joined each other.DESCRIPTION OF RELATED ART [0002]A heat exchanger includes a structure in which a fin member and a tube member are joined each other. For example, in a case of the heat exchanger used as a radiator for cooling an engine of an automobile, the fin member, the tube member, and a tank member are combined, with essential parts of them joined each other. As a main joint part, there are a part between the tank member and the tube member, and a part between the fin member and the tube member, and generally such members are joined each other by soldering and brazing (patent document 1)[0003]If the heat exchanger is classified, with the joint between the fin member and the tube member focused on, there are mainly two kinds such as the heat exchanger made of brass wherein the fin member and the tube member molded by using a plate material of b...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): F28F21/00F28F1/10
CPCB23K1/0012B23K1/19B23K1/203B23K2201/14B23K2203/10F28F2275/04B23K2203/18F28D1/05366F28F1/126F28F21/084F28F21/085B23K2203/12B23K2101/14B23K2101/34B23K2103/10B23K2103/12B23K2103/18
Inventor SASAOKA, TAKAAKIKODAIRA, MUNEO
Owner HITACHI CABLE
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