Method and system for a leaky wave antenna on an integrated circuit package
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a leaky wave and integrated circuit technology, applied in the field of wireless communication, can solve the problems of power inefficiency of transmitters and/or receivers in comparison to other blocks of portable communication devices, and achieve the effect of reducing power consumption and improving power efficiency
Inactive Publication Date: 2010-12-09
AVAGO TECH WIRELESS IP SINGAPORE PTE
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[0028]A system and/or method for a leaky wave antenna on an integrated circuit package as shown in and/
Problems solved by technology
Additionally, transmit and/or receive circuitry within such mobile wireless devices often account for a significant portion of the power consumed within these devices.
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[0039]Certain aspects of the invention may be found in a method and system for a leaky wave antenna on an integrated circuit package. Exemplary aspects of the invention may comprise communicating RF signals using one or more leaky wave antennas in a wireless device. The leaky wave antennas may be integrated in metal layers in an integrated circuit package, and a resonant frequency of the leaky wave antennas may be dependent on one or more cavity heights associated with the metal layers. At least a portion of the one or more cavity heights may be configured utilizing micro-electro-mechanical systems (MEMS) deflection. The RF signals may comprise 60 GHz signals. The leaky wave antennas may comprise microstrip waveguides, where a cavity height of the leaky wave antennas may be dependent on a spacing between conductive lines in the microstrip waveguides. The leaky wave antennas may comprise coplanar waveguides where a cavity height of the leaky wave antennas may be dependent on a spacin...
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Abstract
Methods and systems for a leaky wave antenna LWA on an integrated circuit (IC) package are disclosed and may include communicating RF signals using one or more LWAs in a wireless device. The LWAs may be integrated in metal layers in an IC package, and a resonant frequency of the LWAs may be dependent on cavity heights associated with the metal layers. The cavity heights may be configured utilizing micro-electro-mechanical systems deflection. The RF signals may include 60 GHz signals. The LWAs may include microstrip and/or coplanar waveguides where a cavity height of the LWAs may be dependent on a spacing between conductive lines in the waveguides. The LWAs may be configured to transmit the wireless signals at a desired angle from a surface of the IC package. The IC package may be affixed to a printed circuit board, and an IC may be flip-chip-bonded to the IC package.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS / INCORPORATION BY REFERENCE[0001]This application makes reference to, claims the benefit from, and claims priority to U.S. Provisional Application Ser. No. 61 / 246,618 filed on Sep. 29, 2009, and U.S. Provisional Application Ser. No. 61 / 185,245 filed on Jun. 9, 2009.[0002]This application also makes reference to:[0003]U.S. patent application Ser. No. 12 / 650,212 filed on Dec. 30, 2009;[0004]U.S. patent application Ser. No. 12 / 650,295 filed on Dec. 30, 2009;[0005]U.S. patent application Ser. No. 12 / 650,277 filed on Dec. 30, 2009;[0006]U.S. patent application Ser. No. 12 / 650,192 filed on Dec. 30, 2009;[0007]U.S. patent application Ser. No. 12 / 650,224 filed on Dec. 30, 2009;[0008]U.S. patent application Ser. No. 12 / 650,176 filed on Dec. 30, 2009;[0009]U.S. patent application Ser. No. 12 / 650,246 filed on Dec. 30, 2009;[0010]U.S. patent application Ser. No. 12 / 650,292 filed on Dec. 30, 2009;[0011]U.S. patent application Ser. No. 12 / 650,324 filed on De...
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