Method and system for communicating via leaky wave antennas within a flip-chip bonded structure
What is Al technical title?
Al technical title is built by PatSnap Al team. It summarizes the technical point description of the patent document.
a leaky wave antenna and flip-chip technology, applied in the field of wireless communication, can solve the problems of power inefficiency of transmitters and/or receivers in comparison to other blocks of portable communication devices
Inactive Publication Date: 2010-12-09
AVAGO TECH WIRELESS IP SINGAPORE PTE
View PDF99 Cites 46 Cited by
Summary
Abstract
Description
Claims
Application Information
AI Technical Summary
This helps you quickly interpret patents by identifying the three key elements:
Problems solved by technology
Method used
Benefits of technology
Benefits of technology
[0028]A system and / or method for communicating via leaky wave antennas within a flip-chip bonded structure as shown in and / or described in connection with at least one of the figures, as set forth more completely in the claims.
Problems solved by technology
Additionally, transmit and / or receive circuitry within such mobile wireless devices often account for a significant portion of the power consumed within these devices.
Moreover, in some conventional communication systems, transmitters and / or receivers are often power inefficient in comparison to other blocks of the portable communication devices.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more
Image
Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
Click on the blue label to locate the original text in one second.
Reading with bidirectional positioning of images and text.
Smart Image
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0039]Certain aspects of the invention may be found in a method and system for communicating via leaky wave antennas within a flip-chip bonded structure. Exemplary aspects of the invention may comprise communicating RF signals in a wireless device between a plurality of support structures with one or more integrated leaky wave antennas integrated within and / or on the support structures. The support structures may be coupled via flip-chip-bonding. Low-frequency signals may be communicated via contacts defined via the flip-chip bonding. The RF signals may be communicated between the support structures perpendicular to a surface of the structures. The leaky wave antennas may be configured to transmit the wireless signals at a desired angle from the surface of the support structures, which may comprise at least one of: an integrated circuit, an integrated circuit package, and a printed circuit board. The leaky wave antennas may comprise microstrip waveguides where a cavity height of the...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
PUM
Login to view more
Abstract
Methods and systems for communicating via leaky wave antennas (LWAs) within a flip-chip bonded structure are disclosed and may include communicating RF signals in a wireless device including one or more LWAs between a plurality of support structures, the structures being coupled via flip-chip bonding. Low-frequency signals may be communicated via flip-chip bonding contacts. The RF signals may be communicated perpendicular to a surface and/or at a desired angle from the surface of the structures, which may include at least one of: an integrated circuit, an integrated circuit package, and a printed circuit board. The LWAs may include microstrip and/or coplanar waveguides where a cavity height of the LWAs may be configured by controlling spacing between conductive lines in the waveguides. The low-frequency signals may include DC bias voltages. The RF signals may be communicated from a single LWA to a plurality of LWAs.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS / INCORPORATION BY REFERENCE[0001]This application makes reference to, claims the benefit from, and claims priority to U.S. Provisional Application Ser. No. 61 / 246,618 filed on Sep. 29, 2009, and U.S. Provisional Application Ser. No. 61 / 185,245 filed on Jun. 9, 2009.[0002]This application also makes reference to:[0003]U.S. patent application Ser. No. 12 / 650,212 filed on Dec. 30, 2009;[0004]U.S. patent application Ser. No. 12 / 650,295 filed on Dec. 30, 2009;[0005]U.S. patent application Ser. No. 12 / 650,277 filed on Dec. 30, 2009;[0006]U.S. patent application Ser. No. 12 / 650,192 filed on Dec. 30, 2009;[0007]U.S. patent application Ser. No. 12 / 650,224 filed on Dec. 30, 2009;[0008]U.S. patent application Ser. No. 12 / 650,176 filed on Dec. 30, 2009;[0009]U.S. patent application Ser. No. 12 / 650,246 filed on Dec. 30, 2009;[0010]U.S. patent application Ser. No. 12 / 650,292 filed on Dec. 30, 2009;[0011]U.S. patent application Ser. No. 12 / 650,324 filed on De...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
Application Information
Patent Timeline
Application Date:The date an application was filed.
Publication Date:The date a patent or application was officially published.
First Publication Date:The earliest publication date of a patent with the same application number.
Issue Date:Publication date of the patent grant document.
PCT Entry Date:The Entry date of PCT National Phase.
Estimated Expiry Date:The statutory expiry date of a patent right according to the Patent Law, and it is the longest term of protection that the patent right can achieve without the termination of the patent right due to other reasons(Term extension factor has been taken into account ).
Invalid Date:Actual expiry date is based on effective date or publication date of legal transaction data of invalid patent.
Login to view more
Patent Type & Authority Applications(United States)